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Wonder Automation Inc.

Santa Clara,  CA 
United States
https://wonderautomation.com/
  • Booth: 1944

For advanced automatic wafer handling component & system

Overview

Based in Silicon Valley, California, Wonder Automation offers semiconductor fab’s automated material handling system (AMHS) and overhead hoist transport (OHT), high-performance wafer transfer and inspection equipment, clean room robots and peripherals.

Since the Group’s inception in 2010, it has provided automation services to the world's top semiconductor manufacturers and equipment manufacturers for more than a decade. 

For AMHS, our goal is to become the world’s most cost-effective AMHS automation supplier, helping customers minimize automation costs and risks to step up to smart manufacturing. Our versatile OHT configuration is designed for front-end, back-end, new and old fab.

For wafer handling, Wonder Automation’ expertise lies  in handling fragile and special wafers, all components are made in house for easy configuration to meet client’s needs

  Products

  • Non Contact 12" Thin and Taiko Wafer Handling
    Bernoulli/vortex aided robot end effector and aligner for 12" opaque and transparent thin/Taiko wafer. Non-contact edge grip with SoftTouch mechanism. Works with 3-6 axis robots or tool host via Ethernet communication. Optional top pick/flipping...

    • Since our Group launched its first vortex aided edge grip end effector for thin/Taiko wafer in 2007, we have developed a full line of non-contact (exclusion zone contact only) thin wafer handling solution: for 4"~12" notched or flatted, opaque, translucent or transparent wafer. Traditional pneumo actuated edge grippers handle fragile wafers might result in wafer damage due to overstress or unsecured holding. Our SoftTouch* mechanism with programmable gripping force enables the gripping tips to gently touch wafers. Wafers are held with the programmed constant gripping force. With its closed loop force-feedback, the mechanism prevents wafer stress while holding the wafer gently and securely.

     

    50-0133-300V

    EDGE GRIP/VORTEX AIDED END-EFFECTOR, FOR 300MM THIN/TAIKO OPAQUE/TRANSPARENT WAFER, SOFTTOUCH RESTRICTION TIPS, PHOTO ELECTRICAL WAFER PRESENCE SENSOR PADS, TOP-APPROACH PICK/PLACE, FOR 3-6 AXIS ROBOT

     

    50-0238

    EDGE GRIP/VORTEX SUPPORT CHUCK ALIGNER, FOR 300MM THIN/TAIKO OPAQUE/TRANSPARENT WAFER, SOFTTOUCH MECHANISM, ±25μm/0.02° REPEATABILITY, MAX ±1.5MM OFF CENTER DISPLACEMENT ALLOWED

     

    50-0120-02EP 

    FLIPPER W/ ABSOLUTE ENCODER, 8 ELEC WIRES & 1 AIR/ VACUUM LINE

  • High Precision Wafer Placement
    Self-Centering Edge Gripper and Edge Grip Aligner yield ±25μm/0.02° repeatability respectively, ideal solution for inspection, metrology or laser marking tools. No backside contact to prevent contamination. Optional top pick/place, fast-swap and flipping...

    • 50-0023-300SC

    EDGE GRIP END-EFFECTOR, FOR 300MM OPAQUE/TRANSPARENT WAFER, 3-POINT SELF CENTERING, SPADE TYPE, SOFTTOUCH MECHANISM, ±25μm/0.02° REPEATABILITY (IDENTICAL WAFER DIAMETER ASSUMED), OPTIONAL TOP APPROACH, FLIPPING

     

    50-0237/ 50-0237-B (WITH BUFFER)

    EDGE GRIP ALIGNER, FOR 300MM OPAQUE/TRANSPARENT WAFER, SOFTTOUCH MECHANISM, ±25μm/0.02° REPEATABILITY, MAX ±1.5MM OFF CENTER DISPLACEMENT ALLOWED, OPTIONAL BUFFERING FOR FAST SWAP

  • Non Contact 6" Compound Wafer Transfer Solution
    6”/8” Compound wafer (notched or flatted, manual size change over), Wafer thickness: 300~1200µm, Edge grip handling & aligning, Read wafer ID on both sides, 25 slot random accessible (1.6mm thin blade end effector with rotation tip) ...

    • FEATURE: ALIGN AND CAPTURE WAFER ID, TRANSFER WAFER BETWEEN CARRIERS OR FROM/TO PROCESS MODULE, OPTIONAL TOP-PICK, FLIPPING. SECS/GEM COMPLIANT WITH OPTIONAL COMMUNICATION TO FAB HOST

    ROBOT: JEL GCR4210 OR COMPATIBLE MODEL

    END EFFECTOR: 50-0040 THIN EDGE GRIP END-EFFECTOR, 150 /200MM WAFER. WITH FRONT ROTATION GRIPPING TIP

    ALIGNER: 50-0246 EDGE GRIP/GRAVITY ALIGNER, FOR 150MM OPAQUE/TRANSPARENT WAFER, SOFTTOUCH MECHANISM (OPTIONAL 200MM CONVERSION KITS)

Categories

401 Sub-systems
  • Handling; Transfer; Loading Systems; Lifting devices
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
  • Stockers; Storage, AMHS
    • 701 Manufacturing Services or Consulting
  • Automation & Robotics
  • Wafer Handling

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