Gudeng Precision Industrial Co., Ltd.

1.Low outgassing material: reduce outgassing to pollute the wafer.
2.ESD static dissipative material: preventing the wafer from being damaged by static electricity. 
3.Support OHT.
4.Support RFID funtion.
5.Support purge funtion.
6.Selectable items：
   Purge hole and quantity: customized design

• Size

300mm (12 in.)

• Material

PC(ESD)

• Piece

13 Piece

Supports purge function to control the temperature and humidity of the micro-environment inside the reticle carrier box.

1. Comply with SEMI specification

2. Support OHT function

3. Support RFID function

4. Dual-layer design: EOP (outer layer) and EIP (inner layer)

5. EOP uses static dissipative and low outgassing materials

6. EIP can be operated in a vacuum environment

7. The contact points with the reticle are all wear-resistant materials: effectively reduce particle generation

8. Excellent air tightness

9. Selectable items-EIP form: with pellicle reticle version/without pellicle reticle version

• Size

6 x 6 x 0.25 (in.)

• Material

PEEK(ESD)、Metal

• Usage

Support purge function

• Application

Suitable for EUV process (ASML Certification)