Heidelberg Instruments, Inc.

Torrance,  CA 
United States
https://heidelberg-instruments.com
  • Booth: 1140

Welcome to the Heidelberg Instruments booth!

Overview

Heidelberg Instruments is a world leader in the development and production of high-precision photolithography systems, maskless aligners and nanofabrication tools. The systems range from small and easy to use tabletop systems to highly complex photomask production equipment with exposure areas of several square meters. Heidelberg Instruments systems are installed in academic and industrial sites in more than 50 countries and are used in research, development and production. With over 35 years of experience and more than 1,300 systems installed worldwide, we provide lithography solutions specifically tailored to meet all our customers micro- and nanofabrication requirements for the production of 2D and complex 2.5 and 3D structures – no matter how challenging. Applications include MEMS, BioMEMS, nanotechnology, ASICS, TFT, micro-optics and others. 

  Products

  • MLA 300 MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 Maskless Aligner integrates seamlessly into fully automated production lines with resolutions down to 1.5 µm. Areas of application are advanced semiconductor packaging, IR sensors, MEMS, electronic probes, high-precision electronic components....

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    MLA 300 Maskless Aligner

    Product Highlights

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm2 in 19 minutes

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    User-friendly

    SEMI-compliant user interface; customized workflow “wizards” for system operators

  • NEW! VPG 300 DI Maskless Stepper
    The new VPG 300 DI Maskless Stepper is a Volume Pattern Generator specifically designed for direct writing of high-accuracy and high-resolution microstructures in i-line resists, for use in academic and industrial R&D, or low-volume production....

    • VPG 300 DI Maskless Stepper

    Product Highlights

    Exposure Speed

    Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutes.

    Exposure Quality

    Edge roughness < 40 nm, CD uniformity < 60 nm, resolution down to 500 nm

    Alignment Accuracy

    2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µm

    Automated Alignment

    Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structures

    Autofocus

    Optical or pneumatic autofocus with dynamic compensation up to 80 µm

    Included metrology functions

    Position, CD and edge roughness

    Writing Stability

    Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes
  • ULTRA – FABRICATION OF SEMICONDUCTOR COMPONENTS
    Designed to produce non-critical semiconductor photomasks and non-Manhattan designs, for the fabrication of semiconductor components for electronics and automotive industries, including microcontrollers, LED, IoT, MEMS, ….....

    • The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks.

    Product Highlights 

    High Exposure Quality

    Custom High NA write lens and low distortion UV-optics.

    High Precision

    Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions.

    High Throughput

    Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes

Categories

1 FLEX
  • 3D Printing
  • Advanced Packaging
  • MEMS
  • Tools & Equipment
    • 200 Packaging and Assembly Equipment
  • Litho for WLP: Bumping; 3D Interconnect Aligners
    • 201 Flat Panel Display Equipment
  • Photolithography; backplane, Color Filter and TP
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Lithography/Exposure
    • 304 Mask Making Materials
  • Mask and Reticle Handling Products

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