Equipment can be applied to stack-die bonding process. The chip can be directly bonding through epoxy dispensing or by using DAF film through heating and pressure. It can achieve high-level compatibility for bonding of both epoxy and Die Attach Film(DAF).
Features:
1. Suitable for SiP packaging, Memory Stack Die (memory chip stacking), CMOS, MEMS, and other processes
2. Compatible with 8-12 inch wafers, can correspond to DIP/SOT/QFN lead frames, substrate and carrier
3. Multiple dispensing patterns available
4. With Bonding Stage heating function (room temperature ~ 200°C)
5. Bond force control can be programable 30-300g
6. High-precision placement, placement accuracy ≦ +/- 10μm