Mingkun Technologies Co., Ltd.

Taichung,  Taiwan
https://www.mingkun-tech.com/
  • Booth: 1931

We are tape manufacture in Taiwan

Overview

We Mingkun Technology (MKT)established in 2007, and has been dedicated to the research, development, and manufacturing of semiconductor tapes, and continues to refine and improve the technology. 

With our proud R&D technology, precision instruments, and accurate process control, we provide domestic and foreign wafer makers with a variety of highly difficult and customized tape requirements. And we also expand to semiconductor-related materials, such as laser debond material and material punch, to become a long-term partner of well-known brands such as ASE, AUO, and SPIL. We offer product for process as

  1. Grinding Process: UV/non UV tape (Max. thickness 595um)
  2. Dicing Process: UV dicing tape for wafer/package/glass/LED/copper
  3. Molding / Reflow / EMI shielding/sputter/QFN: PI tape
  4. Heat Sink
  5. Heterogeneous Integration: Laser Debond Film/DAF/double side tape

  Products

  • UV Dicing tape and UV back grinding tape
    Grinding tape protects wafer surface circuitry from damage or contamination during the wafer backside grinding process. Dicing tape is applied for the dicing process, and it can fix the chip to prevent the occurrence of chip-flying....

    • Grinding Tape

    Grinding tape protects wafer surface circuitry from damage or contamination during the wafer backside grinding process.

    • Two types of grinding tape are available: UV and non-UV.
    • MKT's exclusive intermediate layer provides excellent coverage of height bump wafers and is less likely to cause surface dimples and warpage.
    • MKT's grinding tapes are easy to remove after the process is completed and with a low chance of damage and glue residue.
       

      Dicing Tape

      This type of tape is applied for the dicing process, and it can fix the chip to prevent the occurrence of chip-flying.

    • Two types of dicing tape are available: UV and non-UV.
    • MKT dicing tapes have stable adhesion and excellent ductility, no wafer displacement or flying chips, and are suitable for film expansion products.
    • The tapes are easy to unstick, with excellent chip extraction efficiency.
  • Heat resistant PI tape
    Polyimide film-based tapes (PI tapes) are widely used in high-temperature manufacturing processes in the semiconductor and other industries. it can be used for sputter, PVD, CDV, EMI shielding purpose....

    • MKT adhesive is designed with good stability after the heat process, and with good antistatic treatment and low rising temperature.
    • Single-sided, double-sided or anti-static tapes can be made according to customer requirements.
    Adhesion and thickness can be customized.
  • Laser Debonding film
    Temporary bonding material, and it can be used on heterogeneous Integrated process....

    • Laser Debond Material

    • Before debonding, the temporary bonding adhesive has high adhesion to the wafer and can be quickly peeled off by laser.
    • Excellent debond capability for laser 355nm/532nm/1064nm
    • MKT laser debond materials can be preserved at room temperature.

Categories

300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill
  • Bonding; Interconnect: Wire/Ribbon/Tape/Capillaries/Tools
  • Package Substrates; Laminate; Film based
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
    • 701 Manufacturing Services or Consulting
  • Assembly

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