NDS (TAIWAN) Co.,Ltd.

Resin bond blade, with the characteristic of free-cutting and self-sharpening, can efficiently improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard-and-brittle materials such as glass and ceramics.

Electro-formed Nickel bond blade, featured by ultra thin, high strength and stiffness, is extremely rigid. It can give high endurance and robust properties during cutting process while maintaining very low blade wearing rate.

Metal bond blade, sintered and mold pressed under high temp. and pressure, has high rigidity and long blade life. With higher wear-resistance, balanced blade wearing profile, and higher stiffness, the metal bond blades can effectively reduce cutting defects such as slant cut and PKG size/profile issues while providing very long blade life.

Vitrified bond blade with high rigidity and cutting capability is able to keep the straightness on the entry and exit point and precision of work dimension during high-loading process. Consequently, this kind of blade realizes advanced machining on hard materials such as crystals and sapphires. 

Polishing Template : 

This is to replace traditional method of wafer fixing during Chemical Mechanical Polishing (CMP) process. No more worry of waxy residue and wax cleaning process. It offers cushion benefit for best protection for various kinds of wafers. Together with slurry, the poromeric material of template absorbs sufficient moisture after wetting and produces necessary adhesion to hold the wafer well. The superior performance of template can reduce machine down time and increase productivity.
It can be used for single-sided polishing applications.

Polishing Pad : 

It is applied to coarse, middle and fine polishing during the Chemical Mechanical Polishing (CMP) process. With advance PU foaming technology, high planarization and removal rate can be achieved. NDS polishing pads are customized for polishing varieties of workpieces such as silicon wafers, reclaim wafers, SiC, GaAs, sapphire, quartz, ceramic and etc.