CLUSTER PLATFORM HIGHLIGHTS
- Process frame for epitaxial growth of thin films at elevated temperatures up to 1000°C
- Glancing angle deposition on wafers in volume production
- Dynamic in-situ feedback control by PEM or RGA in reactive sputtering
- Electrostatic chuck (ESC) with backside gas for substrate cooling or heating, RF/DC bias option
- P-chuck – pneumatic chuck with edge clamp
- Remote Plasma Sputtering technology
- SECS/GEM, Direct SQL server logging
- Market leading process software technology for accurate real time control of deposition
- Bridge tool – from R&D to 200mm wafers – standard SEMI or custom cassette
SPUTTERING MODULES
The Magnetron Sputtering modules of the Flextura PVD platform handles sputtering processes from well-known standard metallisation or electrode layers to reactive sputtering of highly c-axis oriented and low stress AlN, TCO’s or even ternary alloys.
- Direct planar sputter module
- Confocal sputtering
- Multiple magnetrons
- Multilayers in one module
- Co-sputtering
- Linear sputtering
- Single or dual magnetrons
- Planar or rotatable setup
- HiPIMS sputtering module
- High aspect ratio metallisation
- Layer property tuning
- DC, pDC, and RF, Bipolar magnetron sputtering
- Reactive and nonreactive sputtering
GLANCING ANGLE DEPOSITION
The Flextura GLAD module is a production proven glancing angle evaporation module for industry scale volumes with fully automated substrate handling from cassette. Fully compatible with standard top-down processing ensuring fast and direct integration with complementary processes like degas, etch or sputtering.
Proven up to 200 mm diameter substrates
Rotation: 0-40 rpm, tilt: 0-180°, resolution 0.1°
GLAD stage with water cooling, ESC, or pneumatic chuck
Special ebeam crucible with 12x60cc pockets
Automatic pellet feeder option
Low base pressure <5E-8 mbar
SECS/GEM, MES direct SQL server logging
Proof of concept or contract R&D available for 100 mm!