Develop the chips of the future with SET Flip-Chip Bonders.
Overview
Founded in 1975, SET - Smart Equipment Technology - based in France, is a world leading supplier of high accuracy Flip-Chip Bonders -Die-to-Die and Die-to-Wafer.
With equipment installed worldwide, SET is globally renowned for the unsurpassed submicronic accuracy and the flexibility of its Flip-Chip Bonders.
They adapt to all main bonding techniques: hybrid bonding, fluxless reflow, adhesive joining compression, thermosonic.
SET has representatives in North America and offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.