Tokyo Diamond Tools Mfg. Co., Ltd.

【Diamond Beveling Wheel】

This wheel is used for beveling grinding semiconductor wafers.
We offer "ME" bond for wheels for beveling silicon wafers with excellent sharpness and high maintenance of groove shape. The finished surface roughness is excellent, and the amount of polishing after beveling process is reduced, leading to lower total processing costs by reducing the post-process time and consumables.

For wheels for beveling Sic and Sapphire wafers, we offer optimal bond wheels with excellent sharpness and grinding durability. Electroplating beveling wheels are also available for small and medium volume production.

For wheels for beveling LT and LN wafers, we offer optimal bond specifications that suppress the occurrence of chipping on brittle wafers.。

In addition to general R-shaped (round/full round) and T-shaped grooves, special shapes such as asymmetrical shapes are also covered, so please consult with us.

Applicable materials:
Silicon, SiC (silicon carbide), Sapphire, LT (lithium tantalate), LN (lithium niobate), GaN (gallium nitride), GaAs (gallium arsenide), and Quartz

【Dimaond Notch Wheel】

The demand for quality in the notch area of silicon wafers has been increasing year by year, and the notch wheel abrasive grains with a higher grain size number are increasingly being used. The challenge is to increase the service life of notch wheels that use abrasive grains with high grain size such as #3000.

Although the life of the notch wheel tends to become shorter due to the higher grain size number, the life can be enhanced by improving the hardness and strength of the notch wheel bond. In addition, the use of our original dressing technology AD-C allows for further improvement in service life.

We can provide notch wheels that are compatible with various types of wafers, including compound semiconductors.

The production of compound semiconductor wafers such as SiC and GaN, which are used as substrates for power devices, is expected to grow steadily in the trend toward power saving in a low-carbon society. The key to this growth is the processing cost of wafers, which requires a longer wheel life due to the large amount of allowance in the rough machining prior to surface grinding.

Our porous vitrified bond wheel "VEGA" has both a larger pore diameter and a higher porosity than conventional wheels, maximizing the biting performance to work materials. It is particularly suitable for surface grinding of SiC wafers and can grind 6" SiC wafers without dressing. The excellent wear resistance increases the number of wafers that can be machined per wheel and contributes to the reduction of wafer machining costs.

Diamond mounted metal bond wheels are specially designed for machining hard and brittle materials.
We offer the most suitable bond specifications for various materials in the grinding process of hard and brittle materials using a machining/grinding center.
The metal bond wheel has high abrasive grain retention and high sharpness even when machining hard materials. It also has good thermal conductivity, which prevents heat buildup at the machining point and prevents thermal cracking of brittle materials. The tool life is longer than that of electroplating tools with a single diamond layer, and it is the best tool for machining ceramics, especially hard SiC and aluminum nitride.
In the machining of quartz glass, the optimum bond selection ensures high grinding durability.

We can propose the most suitable bond specifications according to the processing material.
We can propose various shape variations to suit your application.
Even for small-diameter wheels, in which maintaining a core drill shape is difficult, we can offer shapes with slits to improve chip evacuation.

Applicable materials
Silicon Carbide(SiC), Aluminum Nitride(AlN), Silicon Nitride(Si3N4),Quartz Glass, Alumina Ceramics(Al2O3), Silicon(Si), and Sapphire