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Lightspeed Photonics

Singapore City,  Singapore
http://lightspeedphotonics.com
  • Booth: 1935

Next-gen optical interconnect for chip-to-chip communication

Overview

We combine optical interconnects with Processors to build a modular compute+interconnect heterogeneous System-in-Package (SiP), LightSiP™ resulting in a scalable server reducing data latency, footprint, power consumption while increasing the data bandwidth and performance per watt. It incorporates proprietary high data rate free-space optical interconnect, LightKonnect™ for protocol agnostic chip-to-chip communication.

Reconfigurable electronics provides the computing power and optics provides the interconnect; together, the LightSiP™ provides upto 20x performance at half the power.

  Products

  • LightKonnect™
    16 Gbps/Channel, 12 Channel, Protocol-agnostic Parallel Free Space Optics Transmitter and Receiver Modules....

    • LSP-TX-1612-650400 Twelve Channel, Pluggable, Parallel Optics Transmitter and LSP-RX-1612-650400 Twelve Channel, Pluggable, Parallel Optics Receiver are high performance free-space optics modules for short-range parallel multi-lane data communication and interconnect applications in a small LGA Surface Mount Package.
    Features:
    • Free-space optical interconnect
    • Protocol agnostic chip-to-chip communication
    • Single 3.3 V Supply
    • Links up to distances of 150 mm between modules
    • 16Gbps x 12 channel Transmit and Receive lanes
    • 200Gbps/mm (Parallel) – NRZ
    • < 50mW per channel Power consumption ( < 3pJ/bit )
    • I2C Programmable Interface Tx and Rx
    Applications:
    • 200/400/800 GbE interconnects with FDR and EDR channels.
    • Data Aggregation, Proprietary Protocol and Density Applications.
    • High Performance and High Productivity computer interconnects.
    • Switch Fabric interconnects.
  • LightSiP™
    FPGA embedded Co-Packaged Optics Stand-alone, Solderable, 3D optoelectronic System in Package, “LightSiPTM” is for data centers and edge cloudlets to cater high bandwidth real-time applications....

    • Optically interconnected network processor that improves data interface by 100x, performance by 40x per watt, and reduces volume by 5x and cost by 2x. Multiple LightSiPs can be configured in a pre-defined orientation to form an array of processors for distributed computing applications. Additionally, these SiPs can be arranged as 1U or 2U racks.​

    Features:
    • Two FPGAs with 4 highspeed lanes intercommunication with 3000 GFLOPS and 1200 Gbps throughput in 72 free space channels at 100W
    • PCIe external user interface
    • 55mm Hexagon Package
    • Pluggable / Solderable package

    Applications:
    • Near-edge cloudlets and data centres
    • Remote cloud deployment solution
    • Video analytics-CNN applications
    • Video encryption/decryption, resizing, streaming etc.
    • Accelerated Database, Query Management Systems

Categories

1 FLEX
  • 2D, 2.5D or 3D IC Design
  • Advanced Packaging
    • 100 Electronic System Design
  • Packaging Services
  • System Integrators
    • 200 Packaging and Assembly Equipment
  • Package Simulation; Characterization Equipment
    • 400 Components, Parts & Accessories
  • Computer Accessories; Peripherals; Upgrades; Service
  • Connectors; Plugs; Interconnects; Cable; Wire
  • Electronic Hardware; Fixtures and Supplies
    • 401 Sub-systems
  • Computer; Control; Comms.; Data Acquisition Systems
  • Optics; Lens Products; Auto-Focus Systems
    • 701 Manufacturing Services or Consulting
  • Package Mat'ls; Interconnect; Subassembly Design Svcs

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