1. Manual Wafer Mounters
2. Vacuum Wafer Mounters
3. Wafer Laminators

*Denotes products that will be available for a live demonstration at Semicon West 2023

Manual Wafer Mounter P-200* & P-300

The P-200 for up to 8” Wafers and P-300 for up to 12” Wafers offers lot of flexibility and fast conversion for a variety of configurations (different wafers, frames, tapes). The mounting force is controlled by the chuck height adjustment. Wafer and Frame are mounted in one step. 

Semi-Automatic Vacuum Wafer Mounter V-200* & V-300

The V-Series generates the contact between wafer and tape in a 1-3 mBar vacuum within 5-30 seconds of process time to ensure a highly repeatable and void free mounting. Options allow to process Taiko or Bumped Wafer (such as lenses) up to 300m of structure with a pressure controlled mounting force. Super sensitive wafers can be processed completely non-contact and with zero force onto the wafer.

Manual Wafer Laminator L-200* & L-300

The L-200 (up to 8” wafers) and L-300 (up to 12” wafers) are effective solutions for air-void-free mounting of commercially available back-grinding tapes or protection tapes up to 300µ thick. In addition to common silicon wafers, they are often used to process glass, FF4, ceramics and other substrates. They offer very short set-up times, low operating costs, a minimal footprint, and high-quality results.

1. UV-LED Wafer Exposure Systems
2. UV-LED Wafer Flash Exposure System
3. Wafer Expansion Tools

*Denotes products that will be available for a live demonstration at Semicon West 2023

UV-LED Wafer Exposure System U-200* & U-300

The U-200 (up to 8” wafers) and U-300 (up to 12” wafers) are effective solutions for UV curing of commercially available tapes. Compared to common mercury vapor lamp systems, the device is instantaneously operational. The UV LED’s produce neither harmful ozone nor dangerous mercury gas emissions. For higher grade results the device is delivered optionally with means of a Nitrogen supply.

Semi-Automatic UV-LED Wafer Flash Exposure System UF-300

The UV-LED curing system UF-300 is a highly specialized semi-automatic device for highest demands on precision and repeatability of UV tape curing. To ensure a homogeneous energy distribution of +-5% over the entire surface, the individual LED modules are controlled by electronic drivers. The exposure dose recommended by the film manufacturer can be entered in mJ/cm2 via the touch display. Energy values between 75 and 1200 mJ/cm2 per exposure cycle are achieved within 0.5-2.5 s. Higher energy values of up to 10’000 mJ/cm2 or more can also be achieved on a customer-specific needs with an integrated water cooling system.

Manual Expansion Tool ETM-150* & ETM-300

The ETM expands by pressing grip rings on UV and non-UV Tape. The high-quality arbor press ram is made of teniferized (QPQ) steel to exert the necessary expanding pressures. The press top and bottom stamps are available for up to 8” Frames (ETM-150) and for up to 300mm Frames (ETM-300).

1. Film Frame Magazines and Carriers
2. Dicing Services

*Denotes products that will be available for a live demonstration at Semicon West 2023

Magazine for 300mm Frames*

Developed by POWATEC, the 13 or 25 slot magazine is manufactured entirely in Switzerland to the highest quality standards. The side plates are milled from solid aluminum plates, maintaining the smallest tolerances. The magazine is stackable and equipped underneath with positioning pads according to SEMI standard. Innovated by POWATEC and widely adopted by the industry, the lock system in the side plate prevents frame carriers from falling out during transportation. The magazine is particularly suitable for fully automatic production processes according to SEMI standard, either to eject frame carriers from the rear or to remove them from the front by a robot. Precision in slot tolerances play a decisive role. The magazine is available in a wide variety of designs. In addition, customized solutions are offered upon request.

Magazine for 8” Frames*

The magazine is manufactured entirely in Switzerland to the highest quality standards. The side plates are completely milled from solid aluminum plates, maintaining the smallest tolerances. The magazine is suitable for fully automatic production processes according to SEMI standard, either to eject frame carriers from the rear or to remove them from the front by a robot. Precision in slot tolerances play a decisive role. The magazine is available in a wide variety of designs. In addition, customized solutions are offered upon request.

Dicing Services

Our dicing lab is equipped with automatic DISCO and Accretech dicing saws including all necessary equipment and tools to pre/post process wafer dicing.

Our commitment to quality is paramount.