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Shibuya Corporation

JAPAN,  Japan
https://www.shibuya.co.jp/en/semiconductor/index.html
  • Booth: 1930

Welcome! We are a leading company in advanced packaging.

Overview

With the relentless pursuit of miniaturization and enhanced functionality, advanced packaging has emerged as a key enabler of cutting-edge technologies such as Internet of Things (IoT), artificial intelligence (AI), autonomous vehicles, and 5G telecommunications. It enables the realization of complex system-on-chip (SoC) designs, heterogeneous integration of various chip types, and the integration of diverse functionalities within a single package.  Shibuya has been serving the back end packaging industry for more than 40 years. 
Our line up includes, solder ball mounter that can place wide range of solder balls including micro balls, high precision flip chip bonders that can bond at submicron levels, and LED / IC taping and handler machinees.  We specializes in customizing our machinies to meet your R&D or mass production needs.

  Products

  • SBM371
    SBM371 is for automatic solder ball mounting onto BGA substrates with the vision alignment and the utilization of gang fluxing / mounting techniques....

    • Vision inspection aligns the solder and copper balls to gang-mount the balls on the strip-formed or flip chip BGA substrate at high throughput.  The compact and small-footprint design ensure high maintainability.  A fully automatic ball attach line can be configured by connecting the inspection system (model SBI371).

    • Applicable Strip Size Max: 290(L)×120(W) mm Min. 150(L)×30(W) mm
    • Ball Mounting Area:  Max. 270(L)×110(W) mm
    • Ball Placement Accuracy: 3σ＝± 0.05 mm
    • Ball Size : Φ0.15～0.76 mm
    • Balls per Mount : 60,000 balls / mount
    • Ball pitch (MIN) : 0.03mm
    • Sunbstrate thickness : t0.05 ~ 3.00mm
  • FDB210P
    FDB210P is an ultra high precision flip chip/die bonder for mass production of optical devices. This machine achieves submicron ultra high bonding accuracy....

    • This is ultra-high precision thermo-compression (TC) bonder for optical module assembly.
    The high-accuracy alignment mechanism ensures ±0.8µm (3 σ).

    SPECIFICATION

    • Bonding Accuracy Face Down (Bottom Camera): X= +/-0.8um  Y=+/-0.8um (3 sigma)
    • Bonding Accuracy Face Up  (Relay & Top Camera): X= +/-3um  Y=+/-3um (3 sigma)
    • Chip Size: 0.25 – 6.0mm 
    • Substrate Size: Max 10 x 10mm
    • Recipe: 5 kinds /Board *Nozzle changer (Option)
    • Supply Type: Waffle Tray / Gel pack Tray / Grip Ring
    • Bonding Force: 0.1– 8.8N 
    • Heat Application: RT~450℃ Pulse Heat (Head & Stage)
    • Cycle Time: 7 sec/mount *Exclude bonding process time, material change time and calibration time.
  • SBP662
    SBP696 micro ball mounter is for wafer bumping process. his ball mounter is for flux printing and batch-mounting of solder balls after aligning wafers with a high-accuracy vision system. Using metal cup method, balls as small as 0.05mm can be handled....

    • Features
    • The cup method developed by Shibuya exclusively for the micro ball placement is used.
    • The ball collection function drastically reduces remained balls on stencil.
    • The unique ball centering mechanism achieves high-accuracy ball placement.
    • The high-accuracy vision system alignment function and the wafer thickness detect function are combined to achieve stable ball placement.
    • Product changeover time is drastically minimized because the wafer stage and wafer warpage correction plate can handle each wafer size.
    • Remained balls on stencil are collected after the ball placement process.
    Specifications
    Model
    SBP662
    Applicable product type
    Wafer bumping
    Wafer level packages
    Electronic compornent
    Ball size
    φ0.05 to 0.3mm
    Wafer size
    φ8、φ12-inch (4 to 6-inch are optionally available)
    Capacity
    12-inch: 42 WPH * With 1 million φ0.06mm balls
    Positioning accuracy
    ±0.01mm(3σ)
    Line dimensions
    3350 (L) × 1590 (W) × 1750 (H) mm
    Unit weight
    3000 kg

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