Loading...

China Abrasives Industry Hainan Corporation

Haikou City,  Hainan Province 
China
http://china-abrasives.com
  • Booth: 1055

Overview

中国磨料磨具工业海南公司隶属于中国机械工业国际合作有限公司，其前身是中国磨料磨具进出口公司

Corporation, which was approved by the former National Machinery Commission and the State Import and Export Management Committee and founded in 1981. It's a leading 

enterprise in the import and export business of China abrasives industry, and the Chairman Unit of Abrasives Branch of China Machine Tool Industry Association. 

Relying on the strong group advantages and the support of five major R&D and manufacturing bases, the company integrates products and services,and combines importation and 

exportation. Its products are widely used in construction, automobiles, electronics, steel, and energy.

As a comprehensive international-trade platform of SINOMACH-PI, CAEC provides customers with not only professional trade services, but also industry services and technical consulting etc. comprehensive services in abrasives, cutting tools and 

bearing industries based on the group advantages of R&D, production and innovation. CAEC is committed to provide customers with overall solutions.

  Products

  • Back Grinding Wheel
    Used for sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer....

    • Main features:

    The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer, Carborundum wafer, GaAs and GaN wafer. This kind of 

    grinding wheel developed in our company can replace imported products. They can be used steadily on the Japanese, Korean grinders with high performance.

  • Dicing Blade
    Applicatio: Silicon wafer、Compound semiconductor wafers（GaAs、GaP）、oxide wafer(LiTaO3) and others....

    • Main features:

    With electro plated nickel bond，ultrathin hub blades can provide stable dicing performance of narrow street wafers.

  • Resin-Bond Blade
    Sharpness cutting and elastic bond can improve the surface quality. High precision, less dress or no need to dress....

    • Main features: 

    Sharpness cutting and elastic bond can improve the surface quality.

    High precision, less dress or no need to dress.

    Widely used, variety specifications, short delivery time.

    Application: 

    ZS001 series is suitable for semiconductor component(KFN、DFN), which can avoid burrs, and improve efficiency and life.

    ZS002 series is suitable for optical glass, which can avoid chip and improve yield.

    ZS003 series is suitable for quartz glass, which can avoid chips and improve efficiency, and finish of product.

    ZS004 series is suitable for ceramics, which can avoid chips and cracks, and improve the processing quality.

Categories

100 Electronic System Design
  • Semiconductor IP Vendors
    • 200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 206 PV Equipment
  • Wafers
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Quartzware, Ceramic & Oxide Ceramic Fixtures
    • 400 Components, Parts & Accessories
  • Bearings; Shaft Collars
    • 700 Manufacturing Services
  • Measurement; Inspection Service

    • Send Email

    Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined