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MRSI Systems

Tewksbury,  MA 
United States
https://mrsisystems.com
  • Booth: 762

MRSI Systems Die Bonding and Epoxy Dispensing Systems

Overview

MRSI Systems (part of Mycronic Group) based in Massachusetts, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com


  Press Releases

  • MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy.

    The new products, MRSI-H1 and MRSI-HVM1, have been developed from our popular MRSI-H/MRSI-HVM platforms, further improving accuracy to 1 micron level and providing ideal solutions for the increasingly demanding applications such as mass manufacturing of silicon photonics and LIDAR. The MRSI-H1 and MRSI-HVM1 will be available in the Q4, 2022. MRSI’s die bonding solutions help our customers to enable just-in-time supply and fast-pace innovations of critical components for high-growth market segments.

    These products inherit the MRSI tradition of combining accuracy, speed and flexibility to reduce NPI cost, improve production agility and hence increase return-of-investment for customers. They also come with MRSI’s long proven product reliability and global customer support.

    “We are proud to announce the 1µm new die bonders MRSI-H1 and MRSI-HVM1 as part of our efforts to continuously innovate and improve our products to help our customers meet the markets’ demands,” said Dr. Irving Wang, Director of Product Marketing, MRSI Systems.

    For additional information, please contact:
    Irving Wang
    Director of Product Marketing, MRSI Systems, Mycronic Group
    Tel: +1 (978) 667 9449
    E-mail: [email protected]

    Jennifer Russo
    Marketing Manager, MRSI Systems, Mycronic Group
    Tel: +1 (978) 495 9731
    E-mail: [email protected]

    About MRSI Systems
    MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category.

    The MRSI-H-HPLD die bonder was recognized as among the best by the 2022 Laser Focus World Innovators Award. Laser Focus World’s Innovators Awards program celebrates the disparate and innovative technologies, products, and systems found in the photonics market. Submissions were judged on originality; innovation; their impact on designers, systems integrators or users; whether they fulfilled a new market need; leveraged a novel technology and/or increased productivity.

    The system provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high-speed products deliver industry-leading speed without sacrificing flexibility, precision or reliability. MRSI-H-HPLD is equipped with the MRSI patented fast tool changer, fast heating and cooling eutectic stages and multi-process parallel processing capability to maximize productivity, while maintaining maximum flexibility.

    From a customer’s perspective the MRSI-H-HPLD addresses the manufacturing challenges faced by the high growth, high-power semiconductor laser diode (HPLD) market, delivering the best return on investment in the industry for optoelectronic and high power laser device manufacturers.

    Dr. Irving Wang, Director of Product Marketing, MRSI Systems, said, “We are honored to receive the Laser Focus World’s Annual Innovators Award again, which signifies that MRSI’s innovation capabilities continue to be recognized by industry experts. The trust placed upon us by customers and industry experts continues to inspire us to deliver cutting edge innovations for the optoelectronics industry.”

    For additional information, please contact:
    Jennifer Russo
    Marketing Manager, MRSI Systems, Mycronic Group
    Tel: +1 (978) 495-9731
    E-mail: [email protected]

    About Laser Focus World
    Published since 1965, Laser Focus World has become the most trusted global resource for engineers, researchers, scientists, and technical professionals by providing comprehensive coverage of photonics technologies, applications, and markets. Laser Focus World reports on and analyzes the latest developments and significant trends in both the technology and business of photonics worldwide — and offers greater technical depth than any other publication in the field

    About MRSI Systems
    MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.

    “MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high-flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing,” said Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems.

    For additional information, please contact:
    Dr. Irving Wang
    Director of Product Marketing, MRSI Systems, Mycronic Group
    Tel: +1 (978) 667 9449, e-mail: [email protected]
    Time Zone: ET – Eastern Time

    Jennifer Russo
    Marketing Manager, MRSI Systems, Mycronic Group
    Tel: +1 (978) 495 9731, e-mail: [email protected]
    Time Zone: ET – Eastern Time

    About MRSI Systems

    MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com


  Products

  • MRSI-705 5-Micron Die Bonder
    The MRSI-705 5-micron die bonder sets the mark for high-precision, high-speed component assembly....

  • The MRSI-705 5-micron die donder is the industry standard for high-precision component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base for advanced packaging in the industry. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

    The MRSl-705 offers an optional Turret configuration to significantly increase the speed and potential volume from our machine without sacrificing flexibility. This feature delivers an “on-the-fly" tool changer holding up to 12 tools with zero tool changeover downtime This leads to increased machine efficiency, higher output and lower manufacturing costs. Applications include processes requiring a large number of parts-specific tools, using eutectic bonding, and the need to assemble complex products with a multitude of component types. Learn more.

  • MRSI-175Ag Epoxy Dispenser
    The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging....

  • With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation, and multi-pin stamping are all supported on this flexible dispensing platform.

    The MRSI-175Ag Epoxy Dispenser is a high-performance model offered by MRSI Systems. It is a pneumatic dual epoxy dispenser. This type of dispensing system is known for its speed and precision, making it a popular choice in industrial settings. This model is specifically designed for dispensing silver-filled epoxies, making it ideal for use in electronics and other applications where a high-conductivity epoxy is required. In addition to its pneumatic dual head design, it also features a controlled volume dispensing system proven to be highly repeatable, fast and accurate. Learn more.

  • MRSI-S-HVM – Submicron Flip-chip Die Bonder
    Next generation ultra high accuracy solution for speed and flexibility...

    • MRSI-S-HVM designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine.
    • Designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine
    • Two Modes with auto-change over: ±0.5μm @ 3σ and ±1.5μm @ 3σ; both with on-axis z-force for die bonding. MRSI proprietary high z-force option available.
    • Capable of Chip-on-Wafer (CoW); Chip-on-Interposer (CoI); Silicon photonics; die from III-V wafer (8 inches) pick & place onto a silicon wafer (12 inches) and mapping
    • Multiple processes, including DAF, eutectic, epoxy stamping and dispensing, thermal heating from top and bottom, and MRSI proprietary bottom laser soldering.
    • Flip chip bonding with direct alignment of fiducials on both bonding interfaces without additional reference or calibration required. 
    • Learn more.


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