Innovated Technology for the laser system
Overview
ITI, we provide the Innovated Technology in the laser machining process for the semiconductor, secondary battery, photovoltaic, and display fields.
Laser COOL Cut TM for wafer(SiC, TSV, GaN, …) and UTG & Laser COOL Forming TM for TGV(Glass, Quartz) and Ceramic(Si, SiC, Al2O3, …)
COOL Cut ™ technology can dice wafer(SiC, GaN, ultra thin TSV, Sapphire, …) with zero-kerf and without chipping/crack. As demands of thinner and harder semiconductor has risen, level of thickness and hardness became one of the top priorities in wafer cutting process. Recently, the thinner(10μm~60μm thickness TSV) wafer and SiC, GaN wafer are needed. Current laser dicing technique(Stealth Dicing) by melting & vaporizing wafer was proven obsolete due to its inability of preventing chipping, big kerf or big HAZ(Heat Affected Zone) during the cutting process. Such cracks and heat damages can cause fracture and many problems in packaging.
But COOL Cut ™ can dice any thickness(10μm~750μm) wafer and various wafer(SiC, GaN, TSV, Sapphire, GaAs, ....) without melting wafer and without any crack/chipping/burr/heat damage.
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