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Accretech America Inc.

Fremont,  CA 
United States
http://www.accretech.jp/english/
  • Booth: 1251

Welcome to Accretech America Inc. Booth# 1234 South Hall.

Overview

Accretech (Tokyo Seimitsu)  is a global leader in the design and manufacture of semiconductor assembly equipment.

Accretech products have been recognized for exceptional performance and reliability.

Our products include Wafer Probing machines, Dicing Saws, Precision Dicing Blades, Polish Grinders and CMP equipment.

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
    • 208 Test Equipment
  • Discrete Component Test Systems
  • Handlers; Positioner Systems
  • Probing: Analytical; Circuit; Manual; E-Beam; Optical; Wafer
  • Test Head Manipulators and Docking Stations
    • 300 Packaging and Assembly Materials
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 701 Manufacturing Services or Consulting
  • Test Services or Consulting
  • Wafer Handling

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