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Accretech America Inc.

Fremont,  CA 
United States
https://www.accretech.com/en/
  • Booth: 545

Visit Accretech America Inc. at Booth #545 in South Hall!

Overview

Accretech is a premier provider of semiconductor manufacturing equipment. Our products include high-performance Wafer Probing machines, Dicing Saws, Precision Dicing Blades, Polish Grinders and CMP equipment. Our cutting-edge solutions empower semiconductor manufacturers to achieve exceptional levels of accuracy and efficiency in their production processes. With a commitment to innovation and reliability, Accretech continues to drive advancements in semiconductor manufacturing technology. Visit https://www.accretech.com/en/ to discover how our products are shaping the future of the semiconductor industry.

  Products

  • SS30 Dicing Machine
    Semi-automatic dicing machine for Φ300mm wafers...

    • The same high rigidity and gate type structure as in the fully automatic dicer are used. A stable cutting environment is provided by using a structure that is not easily affected by heat contraction or vibration. The maximum workpiece size is Φ 300mm, and the square table specification can handle up to 300 mm x 250 mm square substrates. The use of our originally developed axial mechanism contributes to the speeding up of the X, Y, Z axes and the enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A broad range of uses from silicon to electronic devices can be supported.

    • Compact design, φ300mm wafer compatible dicing machine
      A wide range of materials are supported, from silicon to difficult-to-cut materials. 
      When the square table is selected from the special specification, processing of substrates up to 300 mm x 250 mm can also be supported. 
    • High-performance, high-output spindle equipped as standard
      1.8 kW rating, maximum rotation speed of 60 krpm (a 2.2 kW rating high-torque spindle can also be equipped as an option)
    • Enhanced productivity (throughput) 
      Increased rigidity + servomotorization of the X, Y, Z axes
      Establishment of both a reduced footprint and high throughput
    • High scalability (the standard specification supports various processing modes)
      The feature with multiple workpiece support and an alignment corresponding to the state with multiple workpieces applied to 1 tape frame, and the feature in which the workpiece distortion is detected by the alignment treatment, and the cutting position (Y, θ) is corrected so that the optimal chip is obtained, etc., are equipped as standard. 
      Software features required for various processing uses are equipped as standard, and a wide range are supported from silicon to electronic component processing. 
    • Operability
      A 17-inch touch panel + GUI (Graphical User Interface) are used. 
      Simply by touching the iconized buttons, straightforward and comfortable operation is achieved. 
      The device is equipped with an operation system in common with the AD/SS Series whose use is familiar.
  • AP3000 Probing Machine
    The next-generation ultra-high-performance probing machine for 300mm wafers...

    • The AP3000 is a next-generation ultra-high-performance probing machine designed to achieve high precision, high throughput (index move, wafer handling, and wafer alignment), low vibration and low noise.
    Anti-Virus/Anti-Malware software is installed as standard software on the machine.
    The functions and operability of the AP3000 are inherited from previous models, and it maintains compatibility of recipe and map data. It is very user friendly with safety and security in mind.

    Options:

    • Needle cleaning (cleaning wafer, or cleaning unit)
    • Fan filter unit (mini-environment)
    • HF jig/manipulator, Tester interface
    • Loader : 2 Loader / Automation with AMHS
    • Head stage tilt (Probe card tilt)
    • Chuck: Ambient / Hot temp. / Low temp. /Low noise
    • APC : Auto probe card exchange
    • Cassette ID reading
    • Wafer ID reading (Top surface / Back surface)
    • GB-IB Interface
    • Prober Network (Veganet, Light-Veganet, Vega-Planet, GEM)
    • PCAS (Probe card auto setup)
    • Probe card PGV
    • PLP testing for up to 300mm square

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
    • 208 Test Equipment
  • Discrete Component Test Systems
  • Handlers; Positioner Systems
  • Probing: Analytical; Circuit; Manual; E-Beam; Optical; Wafer
  • Test Head Manipulators and Docking Stations
    • 300 Packaging and Assembly Materials
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 701 Manufacturing Services or Consulting
  • Test Services or Consulting
  • Wafer Handling

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