Polyimide flex circuits, cables, and heaters provided by Fralock are critical components in many applications. We offer single and multi-layer fine-pitch flexible circuits for applications requiring interconnections in a compact package.
Our All-Polyimide flex solutions are smaller, lighter, and can seamlessly integrate into almost any form you need. With a low profile, compact outline, bendable capability, and low weight, Fralock flex and rigid-flex circuits are commonly used in a semiconductor manufacturing.
Fralock offers Adhesiveless Lamination Technology (ALT) to bond polyimide layers, which produces a monolithic bonded material that is able to operate in extreme environmental conditions for extended time without cracking or delaminating.
Our flexible heaters feature etched metal tracings between two sheets or strips of polyimide material. These thermofoil heaters are ideal for applications that require complex shapes and contours, as well as those with tight space and weight constraints.
Fralock’s etched foil cables can be folded without affecting performance. Eliminating the need for adhesives also enables tolerance to a wider range of temperatures, from -269° to 220° Celsius (-452° to 428° Fahrenheit) and renders them about 30 percent thinner and lighter, saving space and labor costs.