Komori America Corporation

• Semiconductor package manufacturing

• High precision/fine wiring bump formation

• Line & space = 20 µm, realize printing Min. line width 5 µm

• Realize Min. Diameter φ10 µm dot printing

• Printing size accuracy less than ± 5 µm (under 300×300 mm)

https://www.komori-america.us/printed-electronics-products/main-equipment/pepio-f6-f12-f15/

• Semiconductor package manufacturing
• Interposer filling

• Adopt auto alignment system
• Realize speed up design
• Equip multi-function for several kind of printing

Fine alignment (for selective) & plugging machine

* Suitable for high aspect ratio plugging

* No bubbles plugging by vacuum

* Various printing usage by vacuum

https://www.komori-america.us/printed-electronics-products/main-equipment/svm-6151ip/

Electronic component-manufacturing technology

• Roll-to-roll manufacturing of MLCCs
• Gapless alignment technology

• Less Bleeding, Resolution and non-defective rate improvement due to consecutive and stable Peel-off printing
• High printing accuracy and repeatability by tension cut on printing
• Less work damage by surface non-touch loading

World’s first! Gap 0 (cylinder synchronous type) screen printing machine

* High printing resolution by screen peel off mechanism (makes fine printing uniformity)

* Printing position accuracy, repeatability and stability (high precision printing)

* Achieve high precision printing repeatability by screen stress free mechanism makes durability + anti-bleeding

https://www.komori-america.us/printed-electronics-products/main-equipment/ryurone-35sz/