The scia Trim 200 is used for high-precision surface trimming of wafers without film and wafer materials limitations. Designed for high-volume production, the system has a throughput and maintenance-optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.
Features & Benefits
- Significant yield improvement
- High precision and high throughput for low production costs
- No edge exclusion with electrostatic chuck
- Sub-nanometer removal with zero base etch function
Applications
- Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
- Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
- Film thickness error or step height correction in thin film head (TFH) manufacturing
- Dimensional correction of MEMS structures