Elephantech Inc.

Chuo-ku,  Tpkyo 
Japan
https://www.elephantech.co.jp/
  • Booth: 1843

World First Successful Mass Production Made in Japan FPC

Overview

Elephantech is Japanes Start up Company with 10 years history,

We have successfully achieved the world's first mass production of flexible printed circuits using our unique metal inkjet printing technology, which employs a low CO2 emission manufacturing process. This technology reduces CO2 emissions by 75%, copper usage by 70%, and water discharge by 95% compared to conventional methods.

This will enable Elephantech to contribute to CO2 reduction in the electronics industry worldwide.


  Press Releases

  • NeuralJet™ is a high-precision inkjet manufacturing technology achieved through advanced control techniques and AI. Rather than individually modeling the numerous error factors such as print operation errors, nozzle individuality, head assembly errors, and nozzle state changes, a single AI model absorbs them all. This enables high-precision ejection using general-purpose piezo chips while achieving a technical configuration suitable for mass production and widespread adoption.

    Elephantech will start mass production of printed circuit boards (PCBs) using this technology from 2025, and will also expand into applications other than PCBs such as semiconductor post-processes and displays.


    Filling φ40μm circular wells
     

    3D imaging of φ40μm circular wells
     

    Filling 40μm wide circular grooves
     

    3D imaging of 40μm wide circular grooves
    Key Feature 1: Ultra-high precision inkjet technology using general-purpose piezo chips

    Using a proprietary printer with general-purpose piezo chips, extremely high printing accuracy has been achieved, such as "average drop position error of less than 2μm*1" and "100% drop landing of 20μm droplets into 40μm grooves and wells*2".

    Key Feature 2: Integrated proprietary AI model that runs on local computing resources

    Rather than modeling and solving individual errors, a proprietary integrated AI model models and absorbs all types of errors. By having AI learn and correct for process and assembly variations in MEMS and more, high accuracy is achieved while building a lightweight model that runs on local computing resources*3.

    Key Feature 3: Fluid control and machine control optimized for easy AI modeling

    Unlike the previous paradigm of "achieving absolute accuracy", fluid control and machine control optimized for "ease of AI modeling" enable high accuracy with a lightweight model.

    Key Feature 4: Practical manufacturing system backed by mass production experience

    Leveraging the experience of being the only company in the world*4 to successfully mass-produce PCBs using inkjet printing of metal nanoparticle ink, a practical manufacturing system usable in mass production sites has been built.
     

    *1: Average drop landing error of 1.74μm (validation set not used for learning) for 643 droplets randomly placed within an 80mm square work.
    *2: 2596 points of 4.8pL droplets ejected into 40μm wide grooves with no adhesion outside the grooves.
    *3: GPU etc. corresponding to equipment scale required.
    *4: Elephantech research, as of announcement Future developments and contact information

    This technology is fully scalable from prototyping to mass production. The development equipment NeuralJet™ L is already operational in our lab, and the production equipment NeuralJet™ P is scheduled to start operation from April 2025. In parallel, we will also develop custom manufacturing processes using this technology for semiconductor post-processes, displays, and more. If you are interested, please contact our Solutions Sales Department.

  • Elephantech Inc. is excited to announce that Elephantech has signed a new Memorandum of Understanding (MoU) with LITE-ON Technology Corporation (LITEON), a global leading tech company headquartered in Taiwan, to promote the mass production of low-carbon Printed Circuit Boards (PCB).

    LITEON is a world-leading provider of opto-semiconductor, power supply management and key electronic products with strong global ecosystem and manufacturing facilities. LITEON has been present in the Japanese market for over 30 years and has leveraged its strategic expansion to broaden its customer base and seize new opportunities. This collaboration is facilitated by LITEON+, a startup platform of LITEON, that aims to accelerate startups steering towards innovative solutions, sustainability, and clean energy. With a shared vision towards net-zero carbon emissions, not only will Elephantech strengthen its reach to global customers, but both companies are also making a commitment to enable a green future.

    The MoU was signed at a ceremony on 15th November at Epson Square Marunouchi, with senior representatives from both companies in attendance including LITEON Japan President Helio Sakaya and Elephantech CEO Shinya Shimizu. Building upon both prior and current collaboration between LITEON and Elephantech, this agreement allows both companies to work on business development of Elephantech’s Low-carbon PCB and its integration to LITEON products with clear goals of decarbonizing electronic devices.

    Elephantech, the world's first developer and manufacturer of low-carbon printed circuit boards (PCB) with metal inkjet printing technology, has revamped its PCB mass production facilities at AMC Nagoya (Elephantech’s factory), enhancing its capabilities to handle large-scale projects. Starting with this collaboration, we will continue to expand and strive for further development in the adoption of low-carbon PCB.


  Products

  • Low Carbon Emission FPC
    The world's first mass production of flexible printed circuits using our unique metal inkjet printing technology, which reduces CO2 emissions by 75%, copper usage by 70%, and water discharge by 95% compared to conventional methods. ...

  • We have successfully achieved the world's first mass production of flexible printed circuits using our unique metal inkjet printing technology, which employs a low CO2 emission manufacturing process. This technology reduces CO2 emissions by 75%, copper usage by 70%, and water discharge by 95% compared to conventional methods."

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