Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and higher accuracy height measurement inspection on the die and wire bond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defects but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.
Kea Features:
-3D Inspection for BLT, Loop Height, BGA & Lead Package (CMOS, Memory & Logic Devices)
-Stacked Die & Multi-Tier Wire Inspection
-Combination of 2D & 3D inspection
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