Fralock

Valencia,  CA 
United States
http://www.fralock.com
  • Booth: 6278

Advanced Materials Solutions for Semiconductor Manufacturing

Overview

Fralock assists semiconductor equipment manufacturers by providing engineered solutions in these areas:

  • Ceramics – with and without active circuitry
  • Flex cabling and circuitry, including flex and rigid-flex configurations
  • Thermal management materials for improving uniformity and distributing/blocking heat
  • Heating technology that includes complex assemblies like ceramic showerheads, polyimide e-chucks, and heater modules.

The primary industry segments we serve include semiconductor front-end equipment as well as back-end test and packaging equipment.

Products Include:

Interface Products

Ceramic Solutions

Polyimide Flex Circuits

Integrated Products and Value Added Processes

  • Custom Designed Modules/ Kits
  • Bonding


  Products

  • Advanced Materials Interface & Laminated Solutions
    Fralock provides components engineered with specialty materials for heat spreading, thermal insulation and blocking, plasma protection, and more. We assist you with design and manufacture of custom to fit your requirements....

  • We provide a variety of  material solutions for passive thermal managment and other functions.

    • Thermal Spreaders & Dissipaters  – We offer effective thermal spreaders to assure uniform heat dispersion across an entire surface (with TC-XY surface >200 W/m∙K). An example is Fralock Thermal Spreader AS, which functions as a gap filler and thermal spreader, and reduces thermal resistance, eliminating heat retention. Other materials include graphite and metal foils. 
    • Gap Fillers – Thermal gap fillers are thermally conductive materials that eliminate air gaps between interfacing components and enhance efficiency of heat transfer. Fralock offers high thermally-conductive silicone rubber gap fillers (with TC-Z surface as high as 17 W/m∙K) as thin as 0.3mm. We can assist in selection and precision manufacturing of complex thermal management fillers with very high thermal conductivity in the thru-plane, providing excellent heat transfer.
    • Polyimide Components - Polyimide offers several benefits for thermal blocking, and is manufactured in thin sheet form, which is then machined, laser cut, or etched to fabricate the component that satisfies your needs.
      • DuPont™ CIRLEX® - Fralock is the sole manufacturer of Cirlex, a thick polyimide that serves as an excellent thermal barrier
    • Encapsulated Interface Solutions for plasma resistance
    • Vibration Dampaneing
    • EMI/RFI Shielding 
    • Electrical Insulation
  • Engineered Technical Ceramics
    Fralock is a provider of rapid-cycling ceramic heaters and engineered structural ceramics for both wafer processing and backend testing and packaging....

  • Using a unique formulation of Aluminum Nitride ceramic with co-fired internal Tungsten traces for heating and temperature sensing, we design and manufacture rapid-fire heaters with exceptional thermal uniformity, watt density, and temperature ramping capabilities. With heating up to 300ºC/second, this laminated material can be precision-machined with air or fluid channels that enhance cooling.

    Heater products include:

    Engineered Structural Ceramics

    Our Alumina and AlN structural ceramics are custom fabricated with high-precision green-to-fire processing systems and stocked, lapped, ground or polished after firing to achieve tight dimensional flatness and surface finish requirements.

    Our expertise in precision machining provides structural ceramics to fit your needs.

    • Ceramic pins
    • Edge rings
    • End effectors
    • Showerheads
    • High voltage insulators
    • Pressure plates
    • Wafer chucks

    Parts can be manufactured into a multitude of shapes and sizes with green machining, lapping, drilling, sintering, laser machining, and polishing.  We can metalize and braze to your specifications.

  • Flexible Circuits and Heaters
    Our flex circuit offerings comprise a wide range of products including polyimide cables, highly complex flex & rigid-flex circuit assemblies, and multi-zoned flex heaters. Fralock’s Adhesiveless Lamination Technology provides superior bond strength. ...

  • Polyimide flex circuits, cables, and heaters provided by Fralock are critical components in many applications. We offer single and multi-layer fine-pitch flexible circuits for applications requiring interconnections in a compact package.

    Our All-Polyimide flex solutions are smaller, lighter, and can seamlessly integrate into almost any form you need.  With a low profile, compact outline, bendable capability, and low weight, Fralock flex and rigid-flex circuits are commonly used in a semiconductor manufacturing.

    Fralock offers Adhesiveless Lamination Technology (ALT) to bond polyimide layers, which produces a monolithic bonded material that is able to operate in extreme environmental conditions for extended time without cracking or delaminating.

    Our flexible heaters feature etched metal tracings between two sheets or strips of polyimide  material. These thermofoil heaters are ideal for applications that require complex shapes and contours, as well as those with tight space and weight constraints.

    Fralock’s etched foil cables can be folded without affecting performance. Eliminating the need for adhesives also enables tolerance to a wider range of temperatures, from -269° to 220° Celsius (-452° to 428° Fahrenheit) and renders them about 30 percent thinner and lighter, saving space and labor costs.


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