Visit Fraunhofer IZM ASSID and IPMS CNT at Semicon West!
Overview
Fraunhofer IZM-ASSID, a branch of Fraunhofer IZM, operates a cutting-edge 200-300 mm technology line for 3D wafer-level system integration using copper-through-silicon via (Cu-TSV) technology. This line is designed for production-oriented and industry-compatible development and processing, adhering to ISO 9001 standards. It includes process modules for TSV forming, post-TSV processing, pre-assembly (thinning and separation), and 3D stack forming. The line facilitates application-related process development, qualification, and prototype production for 3D wafer-level system-in-packages.
Fraunhofer CNT, business unit of the Fraunhofer IPMS carries out applied research on 300 mm wafers for microchip producers, suppliers, device manufacturers and R&D partners. To process customer orders, 4000 m² of class 6 and 3 cleanroom space (in accordance with ISO 14644-1) and laboratory space for over 80 processing and analytical tools are available. The equipment includes deposition and etching systems as well as inspection and analysis devices for determining defects and measuring coating properties.