JTEKT Machinery Americas Corporation

Drive Arlington Heights,  IL 
United States
https://jtektmachinery.com/

• Booth: 6644

JTEKT is one of the leaders in machine tool manufacturing.

Overview

Thoughtful engineering has been the cornerstone of JTEKT Machinery machines since our beginning days in 1941 as Toyoda Machine Works. Originally manufactured for the production lines of a major Japanese automotive company, JTEKT Machinery grinding machines were built to be ruggedly tough in high-production environments.

Over the years, we've held ourselves to this level of expert craftsmanship to provide shops with the highest quality standards. In 1968, we expanded our lineup to horizontal machining centers, and later incorporated automation systems, vertical machining centers and turning lathes, TOP centers, and bridge and boring mills into JTEKT Machinery Americas Corporation's product offerings.

We understand tight tolerances, superior speed, and peak performance. Every detail is carefully considered – from the solid cast iron bases to the operator-friendly ergonomic design – to help maximize production across metalcutting industries.

JTEKT Machinery machines are engineered for innovators, and built with the speed, strength, and capacity to get you there. 

  Press Releases

• KOYO Machinery USA merges with JTEKT Machinery Americas (Mar 06, 2024)

  Effective January 1, 2024, Koyo Machinery USA, a leading provider of precision grinding machines and systems for production applications, will be integrated into JTEKT Machinery’s range of products, services, and customer support operations.

  This merger is an extension of JTEKT Corporation’s global brand unification initiative launched in 2021 which is designed to strategically reshape the company for increased efficiency and greater synergy between group companies, said Michael Defer, President and CEO, JTEKT Machinery Americas Corporation. “This is a positive change that will provide higher value and benefits to our customers,” according to the company.

  With the JTEKT affiliation dating back to 2006, this development now formally integrates KOYO into JTEKT Machinery’s operational infrastructure which means the capacity for customer service and support is significantly expanded.

  Expanded capabilities include service responsiveness, a larger spare parts and support organization, strengthened engineering resources, and a vastly improved machine and component rebuild division.

  Koyo remains in Michigan

  Additionally, Koyo Machinery’s operational core will remain in the Detroit area, moving to JTEKT Machinery’s Wixom, Michigan facility. All existing Koyo Machinery customers are encouraged to direct service and parts inquiries to JTEKT Machinery’s primary support lines, while the existing contact Koyo information will remain active for the foreseeable future. Koyo had been headquartered in Plymouth, MI.

  Leading grinding machine manufacturers around the world have relied on technology for high volume precision grinding. Each machine is designed and built to provide reliable long-term performance.

  Koyo machines include centerless, surface and special purpose grinders, such as silicon disc grinders. The company recently demonstrated a new double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today which grind to 3-4 microns, according to the company. The new machine design is a first in the industry.

  A single, trusted source

  “Our primary lines—Koyo grinders and JTEKT machining centers and grinders--combine with our additional turning and large bridge machines, to create synergistic strengths for supporting manufacturing in diverse industries with metalcutting machines including horizontal and vertical machining centers, bridge mills, boring mills, and grinding machines,” said Mr. Defer. “We can add to that our automation, application engineering, controls and rebuild services to provide our customers end-to-end lifetime support of their manufacturing from a single, trusted source.”

• JTEKT Introduces New High-Productivity Silicon Wafer Disc Grinder (Mar 21, 2024)

  JTEKT offers a double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today which grind to 3-4 microns, according to the company.

  The new machine design is a first in the industry. A total of 300 machines are installed around the world. Previously, JTEKT offered a single-spindle wafer grinding machine.

  A further advantage, the new DXSG320 grinder footprint is approximately 20% smaller than other machines while including fully automated work handling internal to the machine. Wafers are put into a fixture and loaded into a rack system to carry the wafers into the machine for sizing and finishing to customer specifications.

  To assure correct stock removal and optimum quality, wafer thickness is measured before and after grinding. During grinding, discs float in the fixtures and spin during the grinding process, resulting in rapid, even material removal. Since there is no need to flip over the part during the grinding process, users will save considerable cycle time. According to a spokesman, the machine’s single wafer grinding method makes for ease of automation and easy traceability.

  “A key advantage this machine offers over the vertical spindle design is equal stock removal on both sides of the disc in one operation. This not only reduces the need for multiple machines to achieve desired production levels, users are also assured of consistently removing the same amount of stock on both sides, compared to vertical machines which only grind one side at a time.”

  Key features of the grinder include a GW high frequency spindle with air static pressure and a built-in motor to achieve high speed, high accuracy grinding. In-process, wheel positioning is automatic through high accuracy air gauging. The use of pure water instead of coolant is environmentally friendly.

  The machine is compatible with a variety of data collection systems through easy-to-use communication software.        

  Products