Koh Young Technology Inc.

The Meister D+ is a perfect solution for production-speed 3D inspection for component and die inspection solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign material, and more.

Breakthrough in 3D Measurement for Highly Reflective Components

The Meister D+ combines industry-leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies (mirror surface), a long-term inspection challenge.
▪ Inspect Die or small component down to 0201 metric (008004 inch)
▪ Narrow gap inspection down to 40µm @ 3.5µm resoluiont
▪ Optimized image processing and AI-powered algorithms
▪ Robust inspection with high accuracy, regardless of die or LED characteristics
▪ Revolutionary full 3D height and tilt measurement capability for even highly reflective die surfaces

The ZenStar supports True 3D inspection of highly reflective dice with a mirror surface. Its unparalleled 2D/3D multi-modal technology combines industry-leading Moiré technology and new Koh Young proprietary optics to provide robust and stable inspection for bleeding-edge applications. With its proprietary deep learning technology, the ZenStar offers enhanced capabilities to inspect defect items like micro-cracks, foreign material, chipping, and more

▪ Inspection for wafer bumps, solder balls, copper pillars, flip chips, BGA balls, and more
▪ Versatile inspection for wafer balls and reflective die components
▪ High-resolution, high-speed camera system (0.1µm Z-axis resolution)
▪ Wafer bump inspection (down to 10µm diameter)
▪ Active warpage compensation (inspection algorithm with vacuum support system)
▪ Industry-leading True 3D measurement capabilities enhanced by proprietary deep learning technology
▪ Revolutionary full 3D height and tilt measurement capability for even highly reflective die surfaces