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Heidelberg Instruments

Atlanta,  GA 
United States
https://heidelberg-instruments.com
  • Booth: 153

Overview

Established in 1984, trusted in more than 50 countries with over 1,400 systems installed worldwide, Heidelberg Instruments is a global leader in design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems. Our tools range from tabletop solutions to high-end photomask manufacturing equipment and cater to a variety of needs. Our systems enable a broad spectrum of surface structuring on the micro- and nanoscale, including 2D-patterning, the creation of 2.5D features by Grayscale lithography, and 3D structuring through Two-Photon Polymerization. Due to their flexibility, our systems are valuable assets to the most renowned universities and R&D institutes worldwide, as well as industry production facilities. Typical fields of applications are in micro-optics and photonics, electronics, semiconductors, advanced packaging, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and many others.

  Products

  • MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 Maskless Aligner integrates seamlessly into fully automated production lines with resolutions down to 1.5 µm. Areas of application are advanced semiconductor packaging, IR sensors, MEMS, electronic probes, high-precision electronic components....

    • MLA 300 Maskless Aligner

    Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

    Product Highlights

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm2 in 19 minutes

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    User-friendly

    SEMI-compliant user interface; customized workflow “wizards” for system operators
  • VPG 300 DI | MASKLESS STEPPER
    The maskless direct imager VPG 300 DI is a Volume Pattern Generator specifically designed for direct writing of high-accuracy and high-resolution microstructures in i-line resists, for use in academic and industrial R&D, or low-volume production....

    • VPG 300 DI Maskless Stepper

    The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.

    Product Highlights

    Exposure Speed

    Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutes

    Exposure Quality

    Edge roughness < 40 nm, CD uniformity < 60 nm, resolution down to 500 nm

    Alignment Accuracy

    2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µm

    Automated Alignment

    Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structures

    Autofocus

    Optical or pneumatic autofocus with dynamic compensation up to 80 µm

    Included metrology functions

    Position, CD and edge roughness

    Writing Stability

    Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes
  • ULTRA | SEMICONDUCTOR MASK WRITER
    The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS....

    • ULTRA SEMICONDUCTOR MASK WRITER

    The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
    ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.
     
    Product Highlights

    High Exposure Quality

    Custom High NA write lens and low distortion UV-optics

    High Precision

    Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions

    High Throughput

    Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes
     

Categories

1 FLEX
  • 3D Printing
  • Advanced Packaging
  • MEMS
  • Sensors
  • Tools & Equipment
    • 200 Packaging and Assembly Equipment
  • Litho for WLP: Bumping; 3D Interconnect Aligners
    • 201 Flat Panel Display Equipment
  • Photolithography; backplane, Color Filter and TP
    • 207 Process Equipment
  • Lithography/Exposure

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