We are tape manufacture in Taiwan
Overview
We Mingkun Technology (MKT)established in 2007, and has been dedicated to the research, development, and manufacturing of semiconductor tapes, and continues to refine and improve the technology.
With our proud R&D technology, precision instruments, and accurate process control, we provide domestic and foreign wafer makers with a variety of highly difficult and customized tape requirements. And we also expand to semiconductor-related materials, such as laser debond material and material punch, to become a long-term partner of well-known brands such as ASE, AUO, and SPIL. We offer product for process as
- Grinding Process: UV/non UV tape ( For general and bump wafer)
- Dicing Process: UV dicing tape for wafer/package/glass/LED/copper
- Molding / Reflow / EMI shielding/sputter/QFN: PI tape
- Heat Sink
- Heterogeneous Integration: Laser Debond Film/DAF/double side tape