MRSI Systems

Tewksbury,  MA 
United States
https://mrsisystems.com/eng/
  • Booth: 764

Die bonding, epoxy dispensing, & active alignment solutions

Overview

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm.


  Press Releases

  • MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L Active Aligner. This latest innovation marks a significant expansion of MRSI’s offerings beyond its established expertise in die bonding and precision epoxy dispensing solutions, now encompassing fiber and lens attachment for advanced optical packaging needs.

    The MRSI-A-L represents a cutting-edge solution, featuring an automated fiber and lens attachment machine distinguished by its modular design, boasting up to 12 axes for enhanced versatility. Key features include integrated high-precision pick & place capabilities, precise dot or pattern dispensing functionalities, robust machine vision technology, and active alignment capabilities catering to single and/or dual optical components. Additionally, the system offers precise control over reflective surface angles, laser beam profile measurement and processing, 1µm accuracy laser height detection functions, and intuitive software empowering users with flexible process capabilities. This comprehensive tool is poised to revolutionize optical packaging across various applications including transceivers, silicon photonics, AWGs, LiDAR, and integrated optics.

    Dr. Limin Zhou, General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems, expressed enthusiasm about the launch: “We are delighted to introduce the groundbreaking MRSI-A-L Active Aligner, underscoring our commitment to ongoing innovation and addressing the evolving needs of our customers within the optical industry. This advancement positions us strongly to serve a diverse range of optical applications with unparalleled precision and efficiency.”

    For further details regarding MRSI and the transformative MRSI-A-L Active Aligner, please visit www.mrsisystems.com or reach out to sales.mrsi@mycronic.com.

    For additional information, please contact:

    MRSI Global Sales
    MRSI Systems, 554 Clark Road, Tewksbury, MA 01876 USA
    Tel: + 1 978 667 9449
    E-mail: sales.mrsi@mycronic.com

    Dr. Limin Zhou
    General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems
    Tel: +86 135 0289 9401
    E-mail: limin.zhou@mycronic.com

    About MRSI Systems

    MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic

    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.

    The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. It is the ideal tool for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates.

    The MRSI-705HF inherits the flexibility and robustness of the MRSI-705 platform, which can handle multiple die and process applications with auto-tool changing and laser soldering, eutectic with top and bottom heating, epoxy stamping, and dispensing in one machine.

    “We are proud to announce the new MRSI-705HF high force die bonder as part of our efforts to continuously innovate and help our customers meet the changing needs of the market. It will allow us to better serve customers in power devices and advanced packaging applications” said Dr. Irving Wang, Director of Marketing, MRSI Systems.

    For more information about MRSI Systems and the MRSI-705HF high force die bonder, please visit www.mrsisystems.com or contact sales.mrsi@mycronic.com.

    For additional information, please contact:
    Dr. Irving Wang
    Director of Marketing, MRSI Systems, Mycronic Group
    Tel: +1 (978) 667 9449
    E-mail: irving.wang@mycronic.com

    About MRSI Systems

    MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems, a part of Mycronic Group, a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, has been awarded the Silver Honoree for the Laser Focus World Innovators Award 2023 in the Manufacturing Equipment for Photonic Components category.

    The award recognizes the MRSI-S-HVM submicron die bonder, an advanced die bonder based on MRSI’s field-proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. The MRSI-S-HVM combines speed, flexibility, and precision for multiple die and process applications, such as wafer-level packaging for silicon photonics, chiplets, advanced sensors, co-packaged optics, and general 3D heterogeneous integration.

    Laser Focus World’s Innovators Awards program celebrates innovative technologies and products in the photonics market. Submissions were judged on originality; innovation; as well as impact on users and market. Also considered is the entry’s use of new technologies.

    Dr. Irving Wang, Director of Marketing, MRSI Systems, said, “We are honored to receive the Laser Focus World’s Annual Innovators Award again, which signifies that MRSI’s innovation capabilities continue to be recognized by industry experts. The trust placed upon us by customers and industry experts continues to inspire us to deliver cutting-edge innovations for the optoelectronics industry.”

    For more information about MRSI Systems and the MRSI-S-HVM submicron die bonder, please visit www.mrsisystems.com or contact sales.mrsi@mycronic.com.

    For additional information, please contact:
    Jennifer Russo
    Marketing Manager, MRSI Systems, Mycronic Group
    Tel: +1 (978) 495-9731
    E-mail: jennifer.russo@mycronic.com

    About Laser Focus World
    Published since 1965, Laser Focus World has become the most trusted global resource for engineers, researchers, scientists, and technical professionals by providing comprehensive coverage of photonics technologies, applications, and markets. Laser Focus World reports on and analyzes the latest developments and significant trends in both the technology and business of photonics worldwide — and offers greater technical depth than any other publication in the field.

    About MRSI Systems
    MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com


  Products

  • MRSI-705 high force die bonder
    The MRSI-705HF 5-Micron High Force Die Bonder sets the mark for high-precision, high-speed component assembly....

  • The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. It is the ideal tool for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates. Learn more.

  • MRSI-H1 family - 1µm die bonders
    High speed, flexible, ultra precision 1µm flip-chip die bonders for high volume manufacturing...

  • The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume, high-mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H1 family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving.

    Value to our Customers

    • Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
    • Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
    • Industry leading local technical support teams and application expertise
    • 40+ years of experiences in the industry with reliable 24/7 field operation

    Learn more

  • MRSI-S-HVM – Submicron Flip-chip Die Bonder
    Next generation ultra high accuracy solution for speed and flexibility...

    • MRSI-S-HVM designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine.
    • Designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine
    • Two Modes with auto-change over: ±0.5μm @ 3σ and ±1.5μm @ 3σ; both with on-axis z-force for die bonding. MRSI proprietary high z-force option available.
    • Capable of Chip-on-Wafer (CoW); Chip-on-Interposer (CoI); Silicon photonics; die from III-V wafer (8 inches) pick & place onto a silicon wafer (12 inches) and mapping
    • Multiple processes, including DAF, eutectic, epoxy stamping and dispensing, thermal heating from top and bottom, and MRSI proprietary bottom laser soldering.
    • Flip chip bonding with direct alignment of fiducials on both bonding interfaces without additional reference or calibration required.
    • Learn more.


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