NorCom Systems, Inc.

Norristown,  PA 
United States
http://www.norcomsystemsinc.com
  • Booth: 6161

Leak Testing Without Krypton, Helium or Perfluorocarbon

Overview

NorCom Systems, Inc.  - Leak Testing Without Krypton, Helium or Perfluorocarbon

NorCom Systems, Inc. is the exclusive manufacturer of  Optical Leak Test (OLT) equipment for over 20 years.

Our advanced technology provides automated in-line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. These innovative systems, eliminate the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices. The equipment provides quantitative leak test results in the industry standard of cc-atm/second helium and is MIL STD approved.

The NorCom 2020 is ideal for testing optoelectronic, semiconductor, and PC board mounted devices for military, aerospace and telecommunication applications. This economical system inspects a single device in seconds for gross leaks, eliminating bubble leak testing, and expensive fluorocarbon usage.

Applications:

  • Military Hi-Rel
  • Microelectronics
  • Optoelectronics
  • Microwave
  • PC board-mounted devices
  • Relay
  • Medical devices
  • Display devices
  • MEMS


  Products

  • NorCom System 2020
    NorCom 2020 advanced optical leak test system for hermetically sealed packages....

  • NorCom Systems, Inc. manufactures the NorCom 2020 series Optical Leak Test System, which provides automated in-line, full matrix leak testing of hermetically sealed microelectronic , optoelectronic and wafer level devices.  The 2020 eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.  The system provides quantitative leak test results in the industry standard of cc-atm/second helium and is MIL STD compliant and CE marked.  The NorCom 2020 is ideal for optoelectronic, semiconductor, MEMS, and PC board mounted devices for military, aerospace and telecommunication applications.

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