Scientech Engineering USA Corp.

Santa Clara,  CA 
United States
http://www.scientech.group
  • Booth: 5654

Welcome to Scientech Booth, your partner for success !

Overview

Scientech Engineering USA Corp. was establised in 2015 at the heart of Silicon Valley.   Scientech USA office is a fully owned subsidiary of Scientech Corp. in Taiwan.  Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process. Our wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production.
Scientech wet process equipment with single-wafer and wet-bench type, can be highly customized to adapt new process flow and operational interface.   Scientech USA provide best-in-class trusted support to bridge semiconductor equipment manufacturers and industrial customers. 

  Products

  • Wafer Reclaim Service
    Scientech provides wafer reclaiming services for 12" Si wafers and 6" SiC wafers....

    • 12" Si Wafers 
    - Capacity: 160K / Month
    - Cu and Non-Cu Process
    6" SiC Wafers
    - Grinding, Polishing and Reclaim Service
    - Capacity: 1K / Month

    Advanced Clean Technology

    - 19nm Particle

    - Low Trace Metal (<1E9)

    Advanced Defect Inspection (SP1/SP2/SP5)

    Complete Polishing Process

    - Single/Double Side Polish

    - Final Haze Polish

    Super Flatness (GBIR < 0.5mm)

  • Equipment Design and Manufacturing
    Scientech designs and manufactures wet process equipment and provide bonding and debonding solutions....

    • Scientech wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production. Our wet process equipment with single-wafer and wet-bench type, can be highly customized to adapt new process flow and operational interface.  

    1.  Wet Process - Bench 

    Application

    - Semiconductor: FEOL, BEOL, Compound

    - Advanced Packaging/Bumping

    Feature

    - Cassette type or Cassette-less type

    - Adopted by big international companies

    - Leading-edge technologies

    Process

    - Etch: Metal/Oxide/Nitride remove

    - Stripper: PR/PI strip, Polymer remove

    - Clean: Pre/Post/Flux clean

    - Electro-less Plating: Zn/Ni/Pd/Au

    2. Wet Process - Single Wafer 

    Application

    - Semiconductor: BEOL, Compound

    - Advanced Packaging/Bumping

    Feature

    - nSoak/Immersion + Single

    - Adopted by big international companies

    - Leading-edge technologies

    Process

    - UBM / Metal Etch

    - Flux Clean (Hot DIW)

    - PR Strip

    - Wafer Clean (APC, Soft spray)

    - Final Clean/Mask Clean/Frame Clean

    3. Temporary Bonding De-Bonding

    Application

    - IGBT & SiC Power Device
    - Advanced Packaging for Semiconductor
    Feature

    - User-friendly graphical user interface

    - Adopted by big international companies

    - Leading-edge technologies

    Process

    - Temporary Bonding

    - Temporary De-bonding

    - Release Layer Formation

    - Carrier (Glass) Recycling

     

  • Representative
    Scientech representative products includes metrology, sub-systems, package & materials and repair/refurbishment....

    • Scientech has been engaged in represenative businss for more than 30 years.   We have more than 40 principles manufacturers globally and serve major semiconductor customers across Asia.   Our product lines covers lithography,  etch, thin film and diffusion.    

Categories

1 FLEX
  • Advanced Packaging
  • Components & Devices
  • Inspection & Test
  • Tools & Equipment
    • 100 Electronic System Design
  • Packaging Services
  • Test Tools and Services
    • 200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 308 Substrates
  • Compound Semi substrates (GaAs; GaN; InP; SiGe, etc.)
  • SOI; Silicon on Sapphire (SOS); Silicon Carbide
  • Test; Monitor Wafers; Reclaim or Virgin

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