Thermo Electric Company

Bonded wafers offer a low profile and exact vertical alignment of a mated wafer pair to assure quick and accurate response. This product will respond to the static and dynamic temperature changes occurring in typical wafer bonding processes.

The BTC700 finds application in wafer bonding equipment where knowing and controlling temperature uniformity across mating silicon wafer surfaces is required. MEMS, MOEMS, silicon-on-insulator (SOI), wafer level packaging, and 3 dimensional chip stacking are the main technical categories where wafer bonding is employed.

Bonded Wafers can be fabricated from any wafer diameter so that a specific bonding process can be followed as close as technically possible. As a user of this product, you can expect rapid, accurate, and reliable response to temperature changes that occur during the wafer bonding processes.

Surface mount wafers use the smallest possible sensing elements to reduce thermal mass and increase the response time of each sensor. The material used to fabricate the sensors is carefully chosen for the highest possible accuracy and greatest sensor to sensor uniformity.

This design finds application where knowing and controlling the temperature at the surface of a silicon wafer is critical. Most manufacturers embed their sensors within the wafer’s core. This product focuses its measurement at the wafer’s surface where the most vital processes occur. IN using this product you can expect faster and more accurate response times resulting from the most accurate placement of the sensing elements.

While these products are typically used throughout the semiconductor industry, this technology can also be used to measure the temperature uniformity of any other two dimensional surface.

The TC-700 wafer products employ Thermocouple technology to produce the most accurate and reliable readings.