Trion Technology

MINILOCK LOADLOCKED RIE/PECVD The Minilock is a vacuum loadlock. It is a separate chamber to load the samples. It has a slit valve to the reaction chamber that allows the reactor chamber to stay under vacuum. There is a robotic arm that has a direct drive pick-and-place mechanism that provides high reliability, and accurate loading. The loadlock includes its own pressure gauge. The Minilock is typically used when processes use corrosive gases or you need to control the process environment.

The Minilock is highly configurable for either etching, or deposition. Options include inductively coupled plasma (ICP), endpoints, etc.

For applications not requiring a loadlock, Trion provides either the Phantom Reactive Ion Etcher (RIE, RIE-ICP), or Orion Plasma Enhanced Chemical Vapor Deposition System (PECVD). For more information, visit https://triontech.com

ORACLE PRODUCTION CLUSTER TOOL The Oracle is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators, and up to four process reactors. These process reactors are docked to the central loadlock and run in production-mode, or can be operated independently. The Oracle can also be configured for either the laboratory environment (with single wafer loading), or for full production (with vacuum cassette elevators). Because the Oracle accommodates up to four separate process chambers, there are many possible process combinations, including ash, etch, and deposition modules. Processes are safely run without atmospheric contamination since all chambers are vacuum loadlocked. For more information, visit https://triontech.com