Zhengzhou Research Institute for Abrasives & Grinding Co. Ltd.

Zhengzhou, Henan, P.R. China,  China
http://www.zzsm.com
  • Booth: 6659

Best solution on dicing blades, chucks and grinding wheels.

Overview

Founded in 1958, ZZSM is the unique R&D unit for the abrasive industry in China. 


As the biggest professional leader in this specific area, our main products are dicing blades, singulation blades, chuck tables and other relative products in dicing and singulation application. 


For dicing process, dicing blades for wafers, singulation blades for BGA,QFN, DFN, ceramic substrate, glass and so on can have excellent quality. 


For grinding process, our back grinding wheels for silicon wafer,  SiC wafers and sapphire, edge grinding wheels, notch wheels and so on will help cost down with best life and grinding quality. 


Chuck tables, flanges and wheel mounts, UV tape, dressing boards can provide best solution for you. Fine pore ceramic chuck table has good flatness and parallelism. Size from 2", 4", 6", 8 ",12", max 500mm, round/rectangular and other special shapes are available. 


Monocrystalline and Polycrystalline MPCVD for optical, thermal conductivity, cooper diamond composite is available.

  Products

  • Dicing blades
    Dicing blades for wafer and package substrate dicing like for Silicon, GaAs, SiC wafer; Full thickness serial can meet various kerf requirement, with minimum blade thickness 10- 15um to meet the most harsh dicing street width. ...

    • Wafer dicing blades (12A2) specifications:
    Ø Full thickness serial can meet various kerf requirement, with minimum blade thickness 10- 15um to meet the most harsh dicing street width in global wafer dicing market.
    Ø 3 parameters of a blade define the dicing quality performance: diamond grit size, concentration and bond hardness.Package substrate dicing blades

    Package substrate dicing blades :

    Consistent chipping performance due to strict diamond grit size control;

    high rigidty to realize min 16um kerf;

    high concentration and bond systems extend life time

  • Chuck tables
    2'-12" dicing and grinding chuck tables, spinner table, ESD chuck and so on...

    • Available base and frame material: Aluminm alloy, stainless steel, ceramics

    Size range: 5mm-500mm

    Micro pore size: 5-700um

    Porosity: 30-40%

    Permeability uniformity: 10*10 pressure difference (±3 Kpa)

  • Diamond grinding wheels
    Diamond grinding wheels for Silicon wafer, SiC wafer, sapphire, compound, ceramic and so on; edge and notch grinding wheels, ceramic blocks....

    • Back grinding wheels, fine to 8000# grit size; SiC after grinding coarse 20m, fine 5nm

    Edge grinding and notch wheel, for Silicon wafer and SiC wafer  4-8"

     

    Advantages：

    uniform and consistent

    good surface quality  

    stable and long life

Categories

1 FLEX
  • Tools & Equipment
    • 200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 308 Substrates
  • Diamond substrates
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 700 Manufacturing Services
  • Sawing; Lapping; Grinding; Polishing Service

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