Overview
【A】 Dicing Tape for Wafer and Package
Maxell is supplying several Dicing Tapes with UV releasing adhesives for wafer and package processing.
Pressure sensitive adhesives are lost its strength after UV exposure, then easily peeled off and properly removed.
【B】 Back Grinding Tape
Maxell back grinding tapes precisely follow surface roughness like wafer bumps, as prevents dimple generation and/or wafer damages in back grinding process.
These tapes can be applied for back grinding above 100um bump or more (about ~300um).
【C】 Transcription Lead by Electroforming Method (TLEM)
Maxell provides TLEM to many kinds of semiconductor packages.
Eliminating connection area to patterns, the lead allows customers to assemble more chips on a single substrate.
【D】 Stencil for Flux/Paste Printing and Solder Balls Bumping
Maxell electroforming realizes excellent printing stencils with precise cross-section, smaller hole and form aperture.
Appropriate Volume Print (AVP) Stencil
Special two-layer electroforming “AVP stencil®” can widely control paste deposition rate.