Scientech wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production. Our wet process equipment with single-wafer and wet-bench type, can be highly customized to adapt new process flow and operational interface.
1. Wet Process - Bench
Application
- Semiconductor: FEOL, BEOL, Compound
- Advanced Packaging/Bumping
Feature
- Cassette type or Cassette-less type
- Adopted by big international companies
- Leading-edge technologies
Process
- Etch: Metal/Oxide/Nitride remove
- Stripper: PR/PI strip, Polymer remove
- Clean: Pre/Post/Flux clean
- Electro-less Plating: Zn/Ni/Pd/Au
2. Wet Process - Single Wafer
Application
- Semiconductor: BEOL, Compound
- Advanced Packaging/Bumping
Feature
- nSoak/Immersion + Single
- Adopted by big international companies
- Leading-edge technologies
Process
- UBM / Metal Etch
- Flux Clean (Hot DIW)
- PR Strip
- Wafer Clean (APC, Soft spray)
- Final Clean/Mask Clean/Frame Clean
3. Temporary Bonding De-Bonding
Application
- IGBT & SiC Power Device
- Advanced Packaging for Semiconductor
Feature
- User-friendly graphical user interface
- Adopted by big international companies
- Leading-edge technologies
Process
- Temporary Bonding
- Temporary De-bonding
- Release Layer Formation
- Carrier (Glass) Recycling