"iPaS" utilizes the design, core competencies, and manufacturing capabilities of capacitors and inductors, as well as innovative technology to incorporate these products into the substrate and contribute to the realization of "vertical power supply," "space-saving," and "impedance reduction."
Key attributes:
- Leads the way in space-saving and enhancing power supply performance by reducing SMD components
- Minimizes routing and power loss, which perfectly matches the vertical power delivery concept
- They are applied to both the circuit board in the power supply module and the semiconductor package, reducing PDN impedance across a wide frequency range
DEMONSTRATION
We will present a demo on Integrated Package Solutions on July 9th, 2:35 PM - 2:50 PM at FLEXTalks on the Smart Stage of the expo floor adjacent to the FLEX Exhibits.