Elephantech Inc. is excited to announce that Elephantech has signed a new Memorandum of Understanding (MoU) with LITE-ON Technology Corporation (LITEON), a global leading tech company headquartered in Taiwan, to promote the mass production of low-carbon Printed Circuit Boards (PCB).
LITEON is a world-leading provider of opto-semiconductor, power supply management and key electronic products with strong global ecosystem and manufacturing facilities. LITEON has been present in the Japanese market for over 30 years and has leveraged its strategic expansion to broaden its customer base and seize new opportunities. This collaboration is facilitated by LITEON+, a startup platform of LITEON, that aims to accelerate startups steering towards innovative solutions, sustainability, and clean energy. With a shared vision towards net-zero carbon emissions, not only will Elephantech strengthen its reach to global customers, but both companies are also making a commitment to enable a green future.
The MoU was signed at a ceremony on 15th November at Epson Square Marunouchi, with senior representatives from both companies in attendance including LITEON Japan President Helio Sakaya and Elephantech CEO Shinya Shimizu. Building upon both prior and current collaboration between LITEON and Elephantech, this agreement allows both companies to work on business development of Elephantech’s Low-carbon PCB and its integration to LITEON products with clear goals of decarbonizing electronic devices.
Elephantech, the world's first developer and manufacturer of low-carbon printed circuit boards (PCB) with metal inkjet printing technology, has revamped its PCB mass production facilities at AMC Nagoya (Elephantech’s factory), enhancing its capabilities to handle large-scale projects. Starting with this collaboration, we will continue to expand and strive for further development in the adoption of low-carbon PCB.