July 9, 2024 – Phoenix, AZ and Pittsburgh, PA – 3D InCites, the member-centric content platform for heterogeneous integration technologies, and IMAPS Microelectronics Foundation are excited to announce the first-of-its-kind 3D InCites Community Career Fair.
The goal of the 3D InCites Community Career Fair is to match jobseekers in the microelectronics and advanced packaging fields with leading-edge companies that are building their workforce. All who are open to work – whether a recent graduate or those looking to transition careers/employers – are welcome to attend. The event is co-located with the 2024 IMAPS International Symposium, at the Encore Resort in Everett, MA, and takes place from 4-6 pm on Tuesday, October 1, 2024.
A recent report issued by the Semiconductor Industry Association (SIA) and Oxford Economics titled, Chipping Away: Assessing and Addressing the Labor Market Gap Facing the U.S. Semiconductor Industry, notes a significant talent gap in meeting the industry needs. According to the study, in the U.S. alone, the semiconductor industry’s workforce will grow by nearly 115,000 jobs by 2030, from approximately 345,000 jobs today to approximately 460,000 jobs by the end of the decade. 67,000 of these jobs risk going unfilled in the absence of action to close the gap. The microelectronics industry is just one segment of the technology sector competing for STEM-talent.
“Let’s face it, the advanced packaging workforce is aging, and despite efforts of all industry associations, including IMAPS, we have a lot more to do to attract STEM graduates to our sector of the industry,” said Françoise von Trapp, Editorial Director and Managing Partner of 3D InCites. “Partnering with IMAPS Microelectronic Foundation to hold this Career Fair during IMAPS’ largest annual event is one small way we can support our member companies and help close the talent gap.”
“While these are exciting times for those of us involved in advanced packaging since the signing of the CHIPS and Science Act, we recognize the need for strategic, rapid and sustained semiconductor workforce growth now and in the years to come,” said Brian Schieman, Executive Director of IMAPS. “IMAPS and the IMAPS Foundation are committed to providing various formats of workforce upskilling, professional development and education to the semiconductor industry. We are pleased to partner further with 3D InCites to provide yet another career resource for all K-12 and university students, recent graduates, or those looking to transition career focus and/or employer.”
The 3D InCites Community Career Fair will give all those who are open to work the opportunity to network with potential employers in a casual setting while enjoying refreshments. It will be held in outdoors tent adjacent to the exhibit hall during the late afternoon sessions at IMAPS Symposium. A portion of the proceeds from the event will support the 3D InCites DEI Scholarship Fund, which is administrated by the IMAPS Foundation.
Food and beverage sponsorships are available. All IMAPS members may sponsor and staff a tabletop in the tent and provide employment materials and internship program materials for interested applicants. Limited space available.
- 3D InCites Members: $750/table
- 3D InCites Non-members - $1000/table
For more information about sponsorship contact Brian Schieman. To reserve your table, contact Kristie Bowman.