ENGRICH SOLUTIONS SDN BHD

The wire bonder window clamper is designed to hold the leadframe or substrate securely in during the wire boding process. This ensures that the leadframe or substrate does not move, allowing for precise and accurate placement and looping of the wire bonds.

• Material : Typically made from high-quality, durable material such as high wear resistance stainless steel, withstand high temperatures and presure involved in the bonding process
• Design: Often features a window or an opening that aligns with the bonding site, allowing the bonding tool to access the area without obstruction. Where Insert is ensuring that the leadframe is securely held and correctly positioned.
• Precision: Engineered to provide a firm grip wihout damaging the delicate device, ensuring stability and precision during bonding.

Features:

1. Material :

• Made from high-quality rubber or elastomeric compounds that are non-abrasive and have good thermal and chemical resistance.
• The material is chosen for its flexibility, durability, and ability to gently grip delicate components.

2. Design :

• The tips are designed to fit snugly on the end of the pick-up tool or nozzle.
• They come in various shapes and sizes to accommodate different die sizes and shapes.
• Some tips might have specialized surfacce textures to enhance grip and preventing slipping
• The rubber material provides a gentle yet firm grip, minimizing the risk of cracking and chipping of the dies.
• Can be used with variuos types of dies, including those with sensitive surfaces or edges.
• Designed for easy attachment and removal, allowing for quick replacement when tips wear out or need to be changed for different die sizes.

3. Benefits:

• Damage Prevention : The soft , flexible nature of rubber tips reduces the likelihood of mechanical damage to the dies, protecting their integrity and functionality
• Improved Yield: By ensuring accurate and damage-free placement, rubber tips contribute to heigher yeld rates in semiconductor manufacturing.
• Cost-Effective: Durable and long-lasting, rubber tips reduce the frequency of replacements and downtime,contribute to overall cost savings in the production process.

Features:

1. Material

• Made from high-quality materials like stainless steel, carbides or specialized ceramics to ensure durability and chemical resistance.
• The choice of material depends on the type of fluid being dispensed or the required precision.

      2. Design 

• Precision Tips: Available in various diamaeters to control the flow rate and volume of the dispensed material, allowing for highly accurate application.
• Anti-clogging mechanism: Some nozzles are design with features to prevent clogging, ensuring uninterrupted operation.
• Compatibility: Designed to fit variuos dispensing systems and machines, ensuring versatility in manufacturing processes.

     3. Benefits

• Precision and Accuracy: Ensures that materials are dispensed in the exact required locations and amounts, which is essential for the performance and reliability of semiconductor devices.
• Effiency: Enable high-speed dispensing, which increases throughput and productivity in the manufacturing process. Reduce material waste by ensuring accurate application, leading to cost saving.
• Versalitility: Can handle a wide range of materials, from thick adhesives to fine solder pastes, making them suitable for various applications within semiconductor manufacturing.