Bubble Free Tape Application
The captive roller applies the tape to the wafer and film frame in a manner that excludes entrapped air. The result is bubble-free tape mounting.
Safe, Accurate Tape Trimming System
The tape cutting system is fast, safe and accurate, using a circular blade.
Uniform Tape Tensioner
The tape is held by the tensioning frame until it is rolled into contact with the wafer and film frame. Tape is stretched uniformly in all directions.
Works with All Standard Film Frames
Frames are accurately positioned against locating pins and magnets hold the frames in place
Adjustable, Machine Controlled Roller Pressure
The captive roller and spring loaded platen work together to guarantee repeatable mounting pressure. Repeatable pressure is important for repeatable adhesion. Spring tension may be set at various levels.
Closed Loop Temperature Control
A digital temperature controller regulates platen temperature up to 75 º C. Repeatable mounting temperature is important for repeatable adhesion.
Optional Non-Contact Platen
When it is undesirable for the face of the wafer to come into contact with the platen, an optional Non-Contact Platen is available. With the non-contact platen, the wafer is held in position by vacuum along a narrow ridge around the perimeter. A pressure backup supports the wafer during the tape application. The majority of the wafer remains untouched.
New Motorized Take-Up System
Motorized Take-up System to gather the liner from dicing tape onto a disposable core.Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.
Optional Static Eliminator
Located in the tape path, this device prevents static electricity from building up in the tape.