TDK Corporation of America

             TDK Tape Frame Load Port                                                       

Industry-leading particle reduction performance by airflow control

• Simple, Reliable, Lightweight design
• Pods applicable to 300 mm Tape Frame (SEMI G74) pods
• FOUP/Placement detection
• Frame protrusion detection sensor  

           TDK TAS-PLP 650mm load port                                                        

The TDK TAS-PLP 650mm load port features supreme clean technology based on front-end wafer handling. This loader incorporates SEMI Standard 450 table design with TDK standard loadport and utility interface to meet the high growth PLP packaging market

Features:

• Wide range panel size of 500mm to 650mm
• Options include N2 purge, panel mapping and Ethernet  
• Fast load and cycle time

            TDK 200mm SMIF Loader                                                                

The TDK 200mm SMIF Loader addresses 200mm FAB requirements offering low operational costs and providing a clean wafer environment.   

Features:

• Compatible with SEMI  Standard E63 (BOLTS-M)
• Easily integrates into a variety of 200mm wafer processing tools
• Maintains a clean environment by installing the optional cover
• Opening and closing operation can easily be done by pedal switch 
• Wafer mapping is possible by an optional mapping unit
• Fast load and cycle time

            TDK TAS300 Front Purge load port                                               

The TDK TAS300 Front Purge load port is a high-performance module that provides particle-free operation and fast throughput using TDK’s unique precision control.

Features:

• Proven field Reliability & low Annual Maintenance costs results in Low cost of Ownership
• Particle free/contamination free operation
• Features fast door opening and closing for wafer input and output  
• 30% improvement in cycle time
• FOUP interoperability
• Wafer mapping is possible by an optional mapping unit
• Integrated serial or Ethernet communication

           Ultrasonic gold-to-gold bonding for precision applications                  

Features & Benefits

• Speed: Bonding time down to 0.72 seconds per chip
• Process Flexibility: Ultrasonic, thermosonic, C4, Thermal Compression, Eutectic, Transfer, etc.
• Low Temperature Bonding: <200° C
• Accuracy: ±7µm and options down to ±3µm
• Productivity: Max. 5,500 UPH
• Die size: 2.5mm ~ 65 x 50mm
• Environmentally Friendly: lead-free process and does not require flux

Applications

• RF
• Sensors
• CMOS

GGI is a variant of gold wire bonding.  In ultrasonic GGI flip chip bonding, traditional wire bonds are replaced with gold stud bumps. Replacing the wire with gold stud bumps reduces the size of the device package by up to percent. The ultrasonic GGI process can be used for bump pitches down to 60 µm.

Gold Stud Bump Bonding Equipment Process

Either gold stud bumping equipment or electroplating equipment can be used to apply pure gold to the die that will be used in the interconnect process.  This process is associated with back-end die assembly operations. 

In the case of gold stud  bumping, 1 mil 4N gold wire is used to form the stud bump.  Gold stud bumping machines are preferred in applications where programmability and flexibility are required.  Typical gold stud bump diameters range from 60 to 100 microns depending upon the die passivation opening.

Gold stud bumps are applied sequentially to either the wafer or in some cases substrate materials.  Gold stud bumps may have a geometry that is cone shaped with a  tail or that has been leveled.   If the leveling option is used, throughput will be reduced by 15%.  In GGI flip chip die attach process it is preferred to use gold stud bump geometry with a tail since material is required for collapse process during flip chip die attach.

The gold stud bump has a tall profile that starts  to deform at low force.  In the gold stud bumping process, a gold bump or ball is forced down and ultrasonically bonded to the die surface to make an electrical connection.   Gold stud bumps can be bonded to an aluminum pad and a redistribution layer is not always required.  The preferred ball shear mode in most application is type “A”.   Ball strength typically ranges 25g to 35g.

During the GGI flip chip die attach process the gold stud bump is transferred from the die to the substrate using the die bonder load and ultrasonic power profile.