Engis Corporation

Wheeling,  IL 
United States
http://www.engis.com

• Booth: 368

ENGIS-Bringing the Power of Superabrasive Finishing Systems

Overview

Engis® Corporation is a US-based manufacturer, with a global presence, of high-performance superabrasive lapping, grinding, honing and polishing products and related machinery and accessories.

The company began in 1938, with offices in the US and UK, as a trading company for precision measuring equipment and industrial machinery. The company entered into the abrasives market in the 1940s with the development of its Hyprez Diamond Compounds for precise polishing of critical components for defense and aviation industries. Since that time, Engis expanded its range of superabrasive products, applications and industries served to be recognized as the World Leader in Superabrasive Finishing Systems.

Engis products are developed, customized and supported by teams of experienced research scientists, design and application engineers. 

  Press Releases

• Engis® Corporation’s Innovative Grinding Technology Proves Successful at Leading SiC Wafer Manufacturer (Jun 06, 2024)

  In follow-up to the successful qualification of two Engis Grinding Systems at a prominent US manufacturer of SiC wafers last year, Engis recently announced they will now be shipping an additional two grinding systems to the same manufacturer.

  “We are committed to continuing our efforts to drive investment and production costs down with our grinding system and grinding wheels for SiC ingot and wafer production” commented Sean Gilmore, the President of Engis Corporation.

  The state-of-the-art grinding system, with a fully automated enhanced multi-spindle (Engis’ Hyprez® EAG model), is specially configured for coarse and fine grinding of SiC ingot and wafers up to 200mm.

  The EAG provides a low capital, low operating expenditure solution for high precision wafering, giving an economic benefit to wafer manufacturers. The machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control.

  The aim of any wafering technique is to produce ultra-flat wafers in a fully automatic cassette-to-cassette operation for grinding SiC wafers on both sides and to develop a tailored ‘Grind-to-CMP Process’ for all wafers sliced. (i.e. laser splitting, wire-based slicing).” stated Giho Lee, the Hyprez Business Group Manager.

  Investing in the new single- and dual-spindle grinding system dramatically reduces initial capital expenditure and total cost of ownership. Combining the new tools with Engis grinding wheels enables you to achieve optimum performance in terms of wheel life and surface roughness.

  Engis plans to make substantial further investments in Engis tools going forward.

• Engis Offers High Precision Lapping and Polishing Systems (Jun 10, 2024)

  US-based manufacturer of high-performance superabrasives presents its Hyprez® brand of lapping and polishing machines and accessories.

  For over 80 years, Engis has used their extensive knowledge of natural and synthetic diamond to help customers unlock the full potential of lapping and polishing. The ’Hyprez Advantage’ includes full system solutions - machines, consumables and accessories - designed and manufactured to individual needs.  For high precision lapping and polishing, the FastLap™  series of machines provide maximum efficiency and quality control.

  The state-of-the-art Technology Center houses three labs staffed with technicians who have decades of experience in both the lapping and polishing of a wide variety of materials. The Advanced Materials lab provides process solutions for engineered substrates used in optical, photonic, MEMS, wafer and compound semiconductor applications. Engis’ Hard Disk Drive lab simulates the HDD process for the development and testing of Hyprez precision products, while the Industrial Materials lab develops cost effective solutions for lapping and polishing of components utilized in oil & gas, aerospace, automotive, medical, ceramic, mechanical seal and other markets.

  Hyprez consumable formulas are the result of Engis’ complete understanding of diamond and its application in the lapping process, including its unmatched expertise on how to mill, shape and grade diamond of various types and friability. In addition, a complete range of diamond compounds and lapping lubricants have been specifically formulated.

  Composite lapping plates are central to the superior performance of integrated diamond lapping systems and Hyprez lapping plates are formulated specifically to deliver optimum performance when used with Hyprez diamond slurry and lubricants. The composite material efficiently and rapidly removes stock, while producing high quality surface finish and flatness with diamond superabrasives in both large volume operations and smaller hand lapping and polishing applications. Engis also manufactures two types of conditioning rings for lapping applications- stainless steel backed ceramic work rings and diamond plated conditioning work rings.

  Lastly, the company manufactures stirring and dispensing control units complemented by their convenient-to-use spray nozzles, as well as polishing pads. The EMC-3 MiniMiser® is a compact, reliable dispensing system used to lightly spray fluids ranging from very thin to thick viscosity onto a lap plate or other surface.  Its Hyprez Autostirrer keeps diamond completely dispersed by stirring the slurry with a magnetic spin bar, ensuring even diamond concentration through the lapping cycle. To meet demanding polishing and planarization requirements for industrial and advanced material finishing, Engis offers a full selection of pads and cloths.

  Products