SUSS MicroTec introduces its next-generation projection scanner – the DSC300 Gen3. This proprietary scanning lithography platform has best-in-class throughput with fine (< 2 μm) resolution capabilities at the lowest cost of ownership among 1X projection lithography systems.
The flexible DSC300 Gen3 Bridge-Tool for 200 mm and 300 mm wafers was re-engineered for higher performance and minimized overhead time. The DSC300 Gen3 Scanner delivers a 300 mm wafer throughput of more than 80 wafers per hour.
Its enhanced 1X Wynne-Dyson optics and four recipe-selectable numerical apertures (NA’s) enable the achievement of fine 2 μm features in thin resist, as well as >100 µm DoF in the thick resist. The full-field imaging technology of the DSC300 Gen3 supports industry roadmaps for large die patterning and mixed die packaging for heterogeneous integration. In addition, fan-out wafer-level packaging applications can benefit from its optical die-shift compensation option. This latest die-shift and run-in/run-out mitigation feature corrects for up to ± 200 ppm (30 µm on a 300 mm diameter wafer).
With the projection scanner DSC300 Gen3, SUSS MicroTec offers a complementary technology to its mask aligner portfolio and the lowest cost of ownership alternative for traditional projection stepper lithography.