SANTEC OIS Corporation is a leading manufacturer of advanced non-contact, non-destructive, non-invasive imaging systems, providing solutions to semiconductor, battery and medical markets.
In 2022, Santec OIS launched the latest in its range of high-performance metrology systems for semiconductor wafer inspection, the Thickness Mapping System TMS-2000.
Key Benefits of TMS-2000 for wafer thickness and flatness measurements:
- Accurate measurements, insensitive to temperature variations and vibrations
- Sub-nanometer thickness repeatability
- Full wafer mapping with customizable scan patterns
- Single side illumination
- Wafer-to-wafer comparisons
- Suitable for heavily doped Si as well as power semiconductors and multi-layer wafers
- Measurements compliant with SEMI standards
- Cost advantage over conventional solution
More information available from Santec USA Corp at (201) 488 5505 or online at www.santec.com