The ZenStar supports True 3D inspection of highly reflective dice with a mirror surface. Its unparalleled 2D/3D multi-modal technology combines industry-leading Moiré technology and new Koh Young proprietary optics to provide robust and stable inspection for bleeding-edge applications. With its proprietary deep learning technology, the ZenStar offers enhanced capabilities to inspect defect items like micro-cracks, foreign material, chipping, and more
▪ Inspection for wafer bumps, solder balls, copper pillars, flip chips, BGA balls, and more
▪ Versatile inspection for wafer balls and reflective die components
▪ High-resolution, high-speed camera system (0.1µm Z-axis resolution)
▪ Wafer bump inspection (down to 10µm diameter)
▪ Active warpage compensation (inspection algorithm with vacuum support system)
▪ Industry-leading True 3D measurement capabilities enhanced by proprietary deep learning technology
▪ Revolutionary full 3D height and tilt measurement capability for even highly reflective die surfaces