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Grand Team Technologies PTE LTD

Singapore,  Singapore
http://www.gateam.com.sg
  • Booth: 1072

Overview

Founded in 1999, Grand Team Technologies specializes in designing and manufacturing tools & dies for various types of industries, such as semiconductor, medtech, automotive electronics and smart card security industries. We are located in Ang Mo Kio Techplace II, Industrial Park. Our productions are supervised by experts with twenty over years of experience and we strive to provide the best products & services to be the best precision engineering manufacturer in the world. The company is led by Jason Ng, the Managing Director and his management team. Team members are responsible for daily operations and management of the company.

GRAND TEAM TECHNOLOGIES PTE LTD a highly specialized micro machining process with an exclusive focus on precision engineering on integrated circuit chip and medical device parts & components manufacturing. We offer a comprehensive range of capabilities to address the most complex customer requirements that require design, manufacturing in high precision and micron tolerances products & services.


  Press Releases

  • For over 20 years, Grand Team Technologies focuses exclusively on Semiconductor manufacturing. We assist customers to deliver innovative products and services to market with speed and lean manufacturing practices. With our core strength and capabilities, we are in the industry that demands the highest precision to ensure the quality and Hi-tech technology of IC’s chips. Grand Team Technologies understands and accepts its critical role in this supply chain.

    We offer a wide range of products and services for Semiconductor, MedTech, Automotive Electronics and Smart Card Security Industries.

    Our core capabilities as a solution provider in Micro machining, Tool & Die, Precision Parts & Components and Conversion Kits assembly as below:

    a) Design, Modification and Reverse Engineering for making a new, repair and refurbish Ceramic Porous Vacuum Chuck

    b) Precision Machining for precision Parts & Components from Front End Chuck Table to Back End Tooling and Test assembly Sockets

    c) Fabrication & Assembly for Bond Bonder Vacuum Porous Top Plate and Micro Holes Down Holder Set

    d) Precision Machining and Assembly for Stamp Tools, Mold Tools, Smart Card Tools, Jig Saw Conversion Kits, Metal Parts and Rubber Chuck Table

    e) A solution of Micro Machining for Precision Parts & Components and Assembly


  Products

  • A Precision Press Stamp Tool for Contactless Chips
    Successfully developed the first precision press stamp tool for one of the largest European semiconductor manufacturers produced the world’s thinnest contactless chip with 75 micron thick that thinner than a human hair year 2007. ...

  • 1)  Successfully developed the first precision press stamp tool for one of the largest European semiconductor manufacturers produced the world’s thinnest contactless chip with 75 micron thick that is thinner than a human hair year 2007. We break through with the capabilities to build up a contactless chip precision Press Stamp for 45 micron thinner than the last 75 micron achievement. 

    2) Developed a micro-machining project that required dimension in 150um micro holes with tight tolerances, successfully fabricated a universal vacuum top plate for manufacturers to manufacture a tiny size of sensors and integrated circuit chips year 2010. 

    3) Developed a Vacuum Porous Top Plate project that required 100um and below in pore size with assembly to the Top Plate, successfully fabricated and tested a vacuum porous top plate in tight tolerances for manufacturers to manufacture a tiny size of sensors and integrated circuit chips. 


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