For over 20 years, Grand Team Technologies focuses exclusively on Semiconductor manufacturing. We assist customers to deliver innovative products and services to market with speed and lean manufacturing practices. With our core strength and capabilities, we are in the industry that demands the highest precision to ensure the quality and Hi-tech technology of IC’s chips. Grand Team Technologies understands and accepts its critical role in this supply chain.
We offer a wide range of products and services for Semiconductor, MedTech, Automotive Electronics and Smart Card Security Industries.
Our core capabilities as a solution provider in Micro machining, Tool & Die, Precision Parts & Components and Conversion Kits assembly as below:
a) Design, Modification and Reverse Engineering for making a new, repair and refurbish Ceramic Porous Vacuum Chuck
b) Precision Machining for precision Parts & Components from Front End Chuck Table to Back End Tooling and Test assembly Sockets
c) Fabrication & Assembly for Bond Bonder Vacuum Porous Top Plate and Micro Holes Down Holder Set
d) Precision Machining and Assembly for Stamp Tools, Mold Tools, Smart Card Tools, Jig Saw Conversion Kits, Metal Parts and Rubber Chuck Table
e) A solution of Micro Machining for Precision Parts & Components and Assembly