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AMT Co., Ltd.

Asan-si,  Chungnam 
Korea (South)
http://www.imamt.com
  • Booth: 673

HBM Test Handler and Gas Delivery Logistics System

Overview

Since 2002, Advanced Mechatronics Technology (AMT) has been actively involved in producing semiconductor equipment. Throughout the years, we have witnessed remarkable growth in the South Korean semiconductor industry and have grown alongside it. With over two decades of experience, AMT has established itself as a leading manufacturer in South Korea, renowned for its commitment to innovation, reliability, and high-quality semiconductor equipment.

We are excited to introduce our latest breakthrough products that are set to revolutionize the semiconductor manufacturing process. The AMT HBM Test Handler™, boasting an impressive 5μm alignment accuracy, and the Gas Delivery Logistics System are at the forefront of this technological advancement.

For a visual demonstration of these cutting-edge products, we invite you to watch the YouTube videos showcasing their operation. Please follow the links below:

AMT HBM Test Handler™: https://www.youtube.com/watch?v=dAhEYUehxJA

Gas Delivery Logistics System: https://www.youtube.com/watch?v=VmF4AMuRKlY


  Press Releases

  • https://www.donga.com/en/article/all/20230705/4268749/1

    AMT Co., Ltd. Develops New Technology for Individual Chip Inspection


    Enhances Productivity by Detecting Defects in Advance
    Secures Market Competitiveness with High Precision and High Quality

    AMT Co., Ltd., a South Korean semiconductor equipment company headquartered in Asan, Chungcheongnam-do, has surprised the industry by announcing a recent success in developing the world's first fine-pitch HBM IC inspection equipment.

    The manufacturing of semiconductors involves a sequence of "8 major processes," with the wafer-level process being the foundational step. A circular plate, typically measuring 30 cm in diameter, serves as the wafer, onto which a fine circuit with a thickness of 5 nm (nanometers, where 1 nanometer is equivalent to 1 billionth of a meter) is meticulously etched. Following this, the wafer is divided into individual chips, sometimes referred to as dies. The subsequent stages encompass testing and packaging, commonly known as the back-end processes, which precede the final integration of semiconductors into electronic devices.

    AMT's newly developed technology allows for the individual inspection of chips after the assembly and cutting of the HBM (High Bandwidth Memory) device from the wafer stage. The current testing process for high-performance HBM memory utilizes probe cards that employ wafer-scale Micro-Electro-Mechanical Systems (MEMS) technology. HBM, which vertically stacks multiple DRAMs, offers groundbreaking data processing speeds surpassing those of traditional DRAMs, making it a vital component in the technological advancement of the AI era.

    Due to the progressive miniaturization of semiconductors, specifically in the context of HBM architecture where the spacing between bumps is extremely tight (referred to as fine pitch spacing), it was previously unfeasible to inspect the individual chips after they were cut from the wafer. Nevertheless, AMT has effectively tackled these obstacles by creating groundbreaking technology and introducing a novel solution that facilitates the expansion of the inspection para.

    Previously, the inability to test individual HBM ICs before shipment posed a significant challenge. In the event of defects being discovered by customers after delivery, the entire chipset, including HBM chips integrated with the CPU or GPU, had to be discarded. In such cases, the chip suppliers were responsible for compensating not only for the faulty HBM chips but also for the CPUs or GPUs. However, by implementing the HBM test handler, AMT states that HBM suppliers such as Samsung Electronics, SK Hynix, Micron, and chipset suppliers like TSMC can reduce defect rates, lower costs, improve productivity, and gain a competitive advantage by delivering high-precision, high-quality products. This new technology is expected to significantly expand AMT's market share in the HBM semiconductor inspection equipment industry.

    AMT has successfully developed a test handler for next-generation fine pitch ICs used in HBM production testers by SK Hynix and Samsung, as part of a government project. The 64-para test handler, scheduled to be launched by the end of this year, is expected to contribute to significant revenue growth for AMT by leveraging the synergistic effects of this innovative technology.

    HBM semiconductor ICs are packaged in wafer form and go through a cutting process. During the inspection, individual HBM ICs need to be arranged at a specific interval, with a dimensional tolerance of within 20μm, to meet the requirements for alignment with probe cards. However, no one in the world including global test handler companies from Japan and Switzerland, was able to implement the technology to achieve device spacing within 20μm. Through two years of internal research and development, AMT was able to bring the precision level to within 10μm.

    Founded in 2002, AMT stands out as a team of seasoned experts excelling in semiconductor equipment automation. With a workforce of over 100, with more than half devoted to research and development, AMT truly embraces a technology-intensive approach. The prestigious recognition from the Ministry of Trade, Industry, and Energy in March 2021 further cemented AMT's position as a core strategic technology company in the semiconductor industry. Moreover, AMT's extensive portfolio of over 90 domestic and international patent registrations and applications testifies to its remarkable technological expertise and know-how. With such impressive capabilities, AMT is poised for an exciting future, driving innovation and excellence in the semiconductor equipment sector.

  • Wafer fabs use over 60 different types of gases, many of them toxic, corrosive, and flammable.  These gases are stored in gas cylinders and housed in gas cabinets in the sub fab to be delivered to the main fab.

    Currently in the wafer fabs, these gas cylinders are changed out manually.  There are not only huge labor costs associated with the manual change-out process but also safety and efficiency concerns associated with the manual process.

    AMT's Gas Delivery Logistics System proposes to fully automate the entire gas cylinder change-out process, eliminating the need for human involvement; therefore, reducing cost while enhancing safety and efficiency.

    AMT's Gas Delivery Logistics System is comprised of four main components: mechanized gas cabinet, gas cylinder AGV transporter, gas cylinder stoker, and gas delivery logistics control system.

    The mechanized gas cabinet is the end-point of the GDLS and automates the entire cylinder change-out process including gasket changes and leak tests in 10 to 20 minutes. This system replaces the manual gas cylinder change-out process, which can take 2 to 4 hours.

    The AGV transporters transport gas cylinders to and from gas cylinder stoker to mechanized gas cabinets.  The AGV transporters are equipped with obstacle, collision, and cylinder slip detectors and they communicate with the Gas Delivery Logistics Control System with communication protocol.

    The gas cylinder stoker stores gas cylinders to be handed over to the AGV transporter.  The stoker is equipped with many safety features such as leak detection and uses the same communication protocol to communicate with the Gas Delivery Logistics Control System and the AGV transporter.

    The Gas Delivery Logistics Control System allows Fab operators to maintain tight control over process gases throughout the delivery process including loading and unloading gas cylinders.  The Gas Delivery Logistics Control System also seamlessly integrates with the fab's existing gas management system.

    AMT's Gas Delivery Logistics System boasts over 16 patents granted by the US Patent and Trademark Office, ensuring robust IP protection. This innovative system is further secured by patent registrations in South Korea, the European Union, China, Japan, and Taiwan – key regions for wafer fabrication facilities.

    Since 2002, Advanced Mechatronics Technology has been making semiconductor equipment in South Korea. Throughout the years, we have witnessed remarkable growth in the South Korean semiconductor industry, and we have grown alongside it. With over two decades of experience, AMT has established itself as a leading manufacturer in South Korea, renowned for reliable and high-quality semiconductor equipment.

    https://www.youtube.com/watch?v=VmF4AMuRKlY


  Products

  • AMT Gas Delivery Logistics System (GDLS)
    AMT's GDLS automates the entire gas cylinder handling process – unloading, transportation, and loading – from storage to gas cabinets, eliminating manual labor and offering substantial cost savings for fab operators....

  • Current chip fabs risk accidents & waste money on manual gas handling. AMT's GDLS automates the entire gas cylinder change process: unloading, transport, and loading. Robots in Automated Gas Cabinets (AGC) complete safe swaps in 20 minutes vs. 2-4 hours manually. Automated Guided Vehicles (AGV) transport cylinders & a central server commands the operation. This eliminates labor costs, boosts production, & improves safety.

    AMT's GDLS product line consists of 4 components: 

    1. Automated Gas Cabinet (AGC): Equipped with autonomous handling capabilities, the AGC completes gas cylinder changeouts within 20 minutes (including leak tests) compared to 2-4 hours manually, boosting fab uptime.
    2. Automated Guided Vehicle (AGV): Acts as a self-navigating transport system, carrying cylinders between the AGC and storage, eliminating manual intervention and reducing labor requirements.
    3. Automated Stocker (ASTKR): Manages inventory within the storage room, selecting and preparing cylinders for AGV pick-up, optimizing storage space and cylinder utilization.
    4. Gas Logistics Control Server: The central control hub, coordinating communication and issuing commands to all components, ensuring smooth operation and seamless integration with the existing gas delivery system 
  • AMT HBM Test Handler™
    The AMT5000 is the world's first die-level test handler specifically designed for High Bandwidth Memory (HBM) with an unprecedented 5μm alignment accuracy, enabling final testing of HBM chips...

  • Key Features of the AMT5000:

    • Unmatched Accuracy: Achieve unparalleled precision with vision-guided alignment and adjustments, ensuring a deviation range within 5 microns for fine-pitch probing.
    • Eliminate Jigs and Trays: The AMT5000 eliminates the need for jigs, trays, or pockets, streamlining your testing process.
    • Broad Compatibility: The handler seamlessly integrates with most existing test probe cards, accommodating 3D stacked HBM cubes and SiPs.
    • Reduced Costs: Minimize scrap and rework expenses with final die-level testing.

    Take your HBM testing to the next level.

    Contact Calvin Park at [email protected] to learn more about the AMT5000.


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