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CORTEX ROBOTICS SDN BHD

Bayan Lepas,  Penang 
Malaysia
http://www.cortexrobotics.my
  • Booth: 5854

Welcome to Cortex Robotics, your Partner in AOI Solutions.

Overview

CORTEX ROBOTICS SDN BHD stands at the forefront of innovation in Automation Equipment and Advanced Inspection Solutions. Based in Penang, Malaysia, we specialize in designing, researching, and developing cutting-edge automation solutions for Semiconductor Backend Manufacturing Processes.

Trusted by leading semiconductor manufacturers, we offer a comprehensive range of AOI solutions tailored for various applications including Advanced Packaging inspection, Stacked Die, Multi-tier Wire Die, Glass Wafer, and Wafer Bump. Our offerings include 3D+2D Wirebond AOI, Post-Saw Wafer AOI with SWIR add-ons, Leadframe Inspection AOI, Package Inspection AOI, and Tape and Reel AOI, ensuring precision and efficiency across diverse semiconductor manufacturing needs.

Experience the future of automation and inspection with Cortex Robotics, where innovation meets reliability, and customer satisfaction is our top priority.


  Products

  • Alpha Series-Post Saw Wafer AOI (2D+3D+SWIR)
    High-performance Wafer AOI detects major/minor defects pre/post sawing, supports diverse wafer types/sizes....

  • Alpha series is one of the successful semiconductor defect inspection series Cortex designed. The high-performance Wafer AOI solutions automatically detect major or minor wafer defects providing reliable and precise results. It is suitable for wafer defect inspection before and after the sawing process. It also supports various types and sizes of wafers (4"-12" Bare & Frame wafer) in semiconductor, electronics, automotive, medical and Optoelectronic industries. The upgraded series of wafer AOI now comes with 3D & SWIR technology that is capable to inspect the die inner layer and die sidewall defects and wafer bump for advanced packaging. The new SWIR wafer inspection solution is equipped with higher specification hardware and software to speed up the wafer transition & inspection process.

    View Video

  • Vega Series - 3D & 2D Die & Wirebond AOI
    Vega series is a series of cutting-edge die & wirebond AOI combining 2D & 3D technology...

  • Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and higher accuracy height measurement inspection on the die and wire bond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defects but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.

    Kea Features:

    -3D Inspection for BLT, Loop Height, BGA & Lead Package (CMOS, Memory & Logic Devices)

    -Stacked Die & Multi-Tier Wire Inspection

    -Combination of 2D & 3D inspection

    Watch Video


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